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ADG3245BRUZ

P1-P3P4-P6P7-P9P10-P12P13-P13
ADG3245
–3–
ABSOLUTE MAXIMUM RATINGS*
(T
A
= 25°C, unless otherwise noted.)
V
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
LFCSP Package
␪
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .30.4°C/W
TSSOP Package
␪
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 143°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
Table II. Truth Table
BE SEL* Function
L L A = B, 3.3 V to 1.8 V Level Shifting
LH
A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
H X Disconnect
*SEL = 0 V only when V
DD
= 3.3 V ± 10%
PIN CONFIGURATION
20-Lead LFCSP and TSSOP
TOP VIEW
(Not to Scale)
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
ADG3245
GND
A7
A6
A0
A1
A2
A5
A4
A3
B7
B6
B5
BE
B0
B1
B4
B3
B2
SEL
V
CC
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3245 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. A –11–
EP
ExposedPad.Itis
recommendedthat
theexposedpadbe
thermallyconnected
toacopperplanefor
enhancedthermal
performance.Thepad
shouldbegroundedas
well.
Table I. Pin Description
Mnemoni
c
Description
BE
Bus Enable (Active Low)
SEL
Level Translation Select
A
x
Port A, Inputs or Outputs
B
x
Port B, Inputs or Outputs
EP Exposed Pad. It is recommended
that the exposed pad be thermally
connected to a copper plane for
enhanced thermal performance.
The pad should be grounded as
well.
REV.
$
NOTES
1. IT IS RECOMMENDED THAT THE EXPOSED PAD BE
THERMALLY CONNECTED TO A COPPER PLANE
FOR ENHANCED THERMAL PERFORMANCE. THE
PAD SHOULD BE GROUNDED AS WELL.
14
13
12
1
3
4
B0
15 BE
B1
B2
11
B3
SEL
A5
2
A4
A6
5
A7
7
B7
6
G
ND
8
B6
9
B5
10
B4
19
A2
20 A
3
18
A1
17
A0
16
V
CC
ADG3245
TOP VIEW
(Not to Scale)
REV.–4–
ADG3245
TERMINOLOGY
V
CC
Positive Power Supply Voltage.
GND Ground (0 V) Reference.
V
INH
Minimum Input Voltage for Logic 1.
V
INL
Maximum Input Voltage for Logic 0.
I
I
Input Leakage Current at the Control Inputs.
I
OZ
OFF State Leakage Current. It is the maximum leakage current at the switch pin in the OFF state.
I
OL
ON State Leakage Current. It is the maximum leakage current at the switch pin in the ON state.
V
P
Maximum Pass Voltage. The maximum pass voltage relates to the clamped output voltage of an NMOS device
when the switch input voltage is equal to the supply voltage.
R
ON
Ohmic Resistance Offered by a Switch in the ON State. It is measured at a given voltage by forcing a specified
amount of current through the switch.
⌬R
ON
On Resistance Match between Any Two Channels, i.e., R
ON
Max – R
ON
Min.
C
X
OFF OFF Switch Capacitance.
C
X
ON ON Switch Capacitance.
C
IN
Control Input Capacitance. This consists of BE and SEL.
I
CC
Quiescent Power Supply Current. This current represents the leakage current between the V
CC
and ground pins.
It is measured when all control inputs are at a logic HIGH or LOW level and the switches are OFF.
⌬I
CC
Extra power supply current component for the BE control input when the input is not driven at the supplies.
t
PLH
, t
PHL
Data Propagation Delay through the Switch in the ON State. Propagation delay is related to the RC time constant
R
ON
¥ C
L
, where C
L
is the load capacitance.
t
PZH
, t
PZL
Bus Enable Times. These are the times taken to cross the V
T
voltage at the switch output when the switch turns on
in response to the control signal, BE.
t
PHZ
, t
PLZ
Bus Disable Times. This is the time taken to place the switch in the high impedance OFF state in response to the control
signal. It is measured as the time taken for the output voltage to change by V
⌬
from the original quiescent level,
with reference to the logic level transition at the control input. (Refer to Figure 3 for enable and disable times.)
Max Data Rate Maximum Rate at which Data Can Be Passed through the Switch.
Channel Jitter Peak-to-Peak Value of the Sum of the Deterministic and Random Jitter of the Switch Channel.
f
BE
Operating Frequency of Bus Enable. This is the maximum frequency at which bus enable (BE) can be toggled.
$
Typical Performance Characteristics–ADG3245
–5–
V
A
/V
B
– V
R
ON
–
⍀
0
0 0.5
T
A
= 25ⴗC
SEL = V
CC
5
10
15
20
25
30
35
40
1.5 2.5 3.5
V
CC
= 3V
V
CC
= 3.3V
V
CC
= 3.6V
3.02.01.0
TPC 1. On Resistance vs.
Input Voltage
V
A
/V
B
– V
R
ON
–
⍀
0
0 0.5
5
10
15
20
1.5
2.01.0
ⴙ25ⴗC
ⴙ85ⴗC
ⴚ40ⴗC
= 3.3V
SEL = V
CC
V
CC
TPC 4. On Resistance vs. Input
Voltage for Different Temperatures
V
CC
– V
V
OUT
– V
0
0 0.5
0.5
1.5
2.5
1.5 2.5
V
CC
= 2.7V
V
CC
= 2.5V
V
CC
= 2.3V
T
A
= 25ⴗC
SEL = V
CC
I
O
= –5␮A
2.0
1.0
1.0 2.0 3.0
TPC 7. Pass Voltage vs. V
CC
V
A
/V
B
– V
R
ON
–
⍀
0
0 0.5
5
10
15
20
25
30
35
40
1.5 2.5
V
CC
= 2.3V
V
CC
= 2.5V
V
CC
= 2.7V
T
A
= 25ⴗC
SEL = V
CC
3.02.01.0
TPC 2. On Resistance vs.
Input Voltage
V
A
/V
B
– V
R
ON
–
⍀
0
0 0.5
5
10
15
ⴙ85ⴗC
ⴙ25ⴗC
1.0
ⴚ40ⴗC
= 2.5V
SEL = V
CC
V
CC
1.
2
TPC 5. On Resistance vs. Input
Voltage for Different Temperatures
V
CC
– V
V
OUT
– V
0
0 0.5
0.5
1.5
2.5
1.5 2.5
V
CC
= 3.6V
V
CC
= 3.3V
V
CC
= 3V
3.5
T
A
= 25ⴗC
SEL = 0V
I
O
= –5␮A
2.0
1.0
1.0 2.0 3.0
TPC 8. Pass Voltage vs. V
CC
V
A
/V
B
– V
R
ON
–
⍀
0
0 0.5
5
10
15
20
25
30
35
40
1.5 2.5
V
CC
= 3V
V
CC
= 3.3V
V
CC
= 3.6V
3.5
T
A
= 25
ⴗ
C
SEL = 0V
1.0 2.0 3.0
TPC 3. On Resistance vs.
Input Voltage
V
CC
– V
V
OUT
– V
0
0 0.5
0.5
1.5
2.5
1.5 2.5 3.5
V
CC
= 3.6V
V
CC
= 3.3V
V
CC
= 3V
3.0
2.0
1.0
1.0 2.0 3.0
T
A
= 25ⴗC
SEL = V
CC
I
O
= –5␮A
TPC 6. Pass Voltage vs. V
CC
ENABLE FREQUENCY – MHz
I
CC
–
␮A
0
02
4
200
6810
T
A
= 25ⴗC
12
V
CC
= 3.3V, SEL = 0V
14 16 18 20
400
600
800
1000
1200
1400
1600
1800
V
CC
= SEL = 3.3V
V
CC
= SEL = 2.5V
TPC 9. I
CC
vs. Enable Frequency
REV.
$
P1-P3P4-P6P7-P9P10-P12P13-P13

ADG3245BRUZ

Mfr. #:
Buy ADG3245BRUZ
Manufacturer:
Analog Devices Inc.
Description:
Translation - Voltage Levels 2.5V/3.3V 8-Bit 2-Port Bus Switch
Lifecycle:
New from this manufacturer.
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