NCS5652, NCV5652
www.onsemi.com
3
Table 2. ABSOLUTE MAXIMUM RATINGS Over operating free−air temperature, unless otherwise stated
Parameter
Symbol Limit Unit
Supply Voltage (V
CC
− GND) V
CC
16 V
Output Supply Voltage VC1, VC2 16 V
INPUT AND OUTPUT PINS
Differential Input Voltage
V
id
±V
CC
V
Input Common Mode Voltage Range V
ICR
−0.3 to V
CC
+0.3 V
Output Current (Note 1) I
OUT
±1000 mA
DISABLE/Tflag Pin Voltage (Note 2) V
DISABLE/Tflag
7 V
TEMPERATURE
Storage Temperature
T
STG
−65 to 165 °C
Junction Temperature T
J(MAX)
150 °C
ESD RATINGS (Note 3)
Human Body Model HBM ±1500 (IN−, Tflag pins).
±2000 (All other pins)
V
Machine Model MM ±150( IN−, Tflag pins).
±200 (All other pins)
V
Charge Device Model CDM ±2500 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Continuous short−to−ground or source; power dissipation must be taken into consideration.
2. Connected to voltage source via a pull−up resistor.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JEDEC standard: JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (JEDEC standard: JESD22−A115)
ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009 (AEC−Q100−011)
Table 3. THERMAL INFORMATION (Note 4)
Thermal Metric Symbol Limit Unit
Junction to Ambient – UDFN12
(Exposed pad connected to 50 mm
2
one ounce copper.)
q
JA
147 °C/W
Junction to Ambient – UDFN12
(Exposed pad connected to 1200 mm
2
one ounce copper.)
q
JA
52 °C/W
4. Based on JEDEC.
Table 4. RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Limit Unit
Operating Supply Voltage V
CC
3.3 to 13.2 V
Output Supply Voltage VC1
,
VC2 3.3 to 13.2 V
Output Current (Note 5) IC1, IC2 ±500 mA
Operating Temperature Range T
A
−40 to +125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
5. Power dissipation must be taken into consideration to avoid thermal shutdown.
