FDMS86568-F085

FDMS86568-F085 N-Channel PowerTrench
®
MOSFET
©2014 Semiconductor Components Industries, LLC.
August-2017, Rev 3
Publication Order Number:
FDMS86568-F085/D
FDMS86568-F085
N-Channel PowerTrench
®
MOSFET
60 V, 80 A, 3.5 mΩ
Features
Typical R
DS(on)
= 2.6 mΩ at V
GS
= 10V, I
D
= 80 A
Typical Q
g(tot)
= 55 nC at V
GS
= 10V, I
D
= 80 A
UIS Capability
RoHS Compliant
Qualified to AEC Q101
Applications
Automotive Engine Control
PowerTrain Management
Solenoid and Motor Drivers
Integrated Starter/Alternator
Primary Switch for 12V Systems
MOSFET Maximum Ratings T
J
=
25°C unless otherwise noted.
Symbol Parameter Ratings Units
V
DSS
Dr
ain-to-Source Voltage 60 V
V
GS
Gate-to-Sour
ce Voltage ±20 V
I
D
Dr
ain Current - Continuous (V
GS
=1
0) (Note 1) T
C
=
25°C 80
A
Pulsed Drain Current T
C
= 25°C See Figur
e 4
E
AS
Single Pulse Av
alanche Energy (Note 2) 102 mJ
P
D
Powe
r Dissipation 214 W
Derate Above 25
o
C1.43W/
o
C
T
J
, T
STG
Operatin
g and Storage Temperature -55 to + 175
o
C
R
θJC
Therma
l Resistance, Junction to Case 0.7
o
C/W
R
θJA
Maximum The
rmal Resistance, Junction to Ambient (Note 3) 50
o
C/W
Package Marking and Ordering Information
Device Marking Device Package Reel Size Tape Width Quantity
FDMS86568
FDMS86568-F085
Power56 13” 12mm 3000units
Not
es:
1: Current is limited by bondwire configuration.
2: Starting T
J
= 25°C, L =
50uH, I
AS
= 64A
, V
DD
= 60V
during inductor charging and V
DD
= 0V du
ring time in avalanche.
3: R
θJA
is the sum of
the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder
mounting surface of the drain pins. R
θJC
is gu
aranteed by design, while R
θJA
is determin
ed by the board design. The maximum rating
presented here is based on mounting on a 1 in
2
pad
of 2oz copper.
FDMS86568-F085 N-Channel PowerTrench
®
MOSFET
www.onsemi.com
2
Electrical Characteristics T
J
= 25°C unless otherwise noted.
Off Characteristics
On Characteristics
Dynamic Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Units
B
VDSS
Drain-to-Source Breakdown Voltage I
D
= 250μA, V
GS
= 0V 60 - - V
I
DSS
Drain-to-Source Leakage Current
V
DS
= 6 0 V T
J
= 25
o
C --1μA
V
GS
= 0V T
J
= 175
o
C (Note 4) - - 1 mA
I
GSS
Gate-to-Source Leakage Current V
GS
= ±20V - - ±100 nA
V
GS(th)
Gate to Source Threshold Voltage V
GS
= V
DS
, I
D
= 250μA 2.0 3.0 4.0 V
R
DS(on)
Drain to Source On Resistance
I
D
= 80A,
V
GS
= 10V
T
J
= 25
o
C -2.63.5mΩ
T
J
= 175
o
C (Note 4) - 4.9 6.6 mΩ
C
iss
Input Capacitance
V
DS
= 30V, V
GS
= 0V,
f = 1MHz
- 4335 - pF
C
oss
Output Capacitance - 1065 - pF
C
rss
Reverse Transfer Capacitance - 36 - pF
R
g
Gate Resistance f = 1MHz - 2.5 - Ω
Q
g(ToT)
Total Gate Charge V
GS
= 0 to 10V
V
DD
= 48V
I
D
= 80A
-5571nC
Q
g(th)
Threshold Gate Charge V
GS
= 0 to 2V - 8 - nC
Q
gs
Gate-to-Source Gate Charge -23-nC
Q
gd
Gate-to-Drain “Miller“ Charge - 9 - nC
Switching Chara
cteristics
Drain-Source Diode Characteristics
Note:
4:
The maximum value is specified by design at T
J
= 175°
C. Product is not tested to this condition in production.
t
on
Tur
n-On Time
V
DD
= 30V, I
D
= 80A,
V
GS
= 10V, R
GEN
= 6Ω
- -
64 ns
t
d(on)
Tu
rn-On Delay - 21 - ns
t
r
Rise Ti
me - 20 - ns
t
d(of
f)
Tur
n-Off Delay - 33 - ns
t
f
Fal
l Time - 13 - ns
t
off
Turn-
Off Time - - 64 ns
V
SD
Source-to-Drain Diode V
oltage
I
SD
=80A, V
GS
= 0V -
- 1.25 V
I
SD
= 40A, V
GS
= 0V -
- 1.2 V
t
rr
Revers
e-Recovery Time
I
F
= 80A, dI
SD
/dt =
100A/ms
V
DD
= 48V
-67
87ns
Q
rr
Reverse-Recovery Charge -
70 99 nC
FDMS86568-F085 N-Channel PowerTrench
®
MOSFET
www.onsemi.com
3
Typical Characteristics
Figure 1. Normalized Power Dissipation vs. Case
Temperature
0
25 50 75 100 125 150 175
0.0
0.2
0.4
0.6
0.8
1.0
1.2
P
OWER DISSIPATION MULTIPLIER
T
C
,
CASE TEMPERATURE(
o
C)
Figure 2. Maximum Continuous Drain Current vs.
Case Temperature
25
50 75 100 125 150 175 200
0
50
100
150
200
CURR
ENT LIMITED
BY SILICON
CUR
RENT LIMITED
BY PACKAGE
V
GS
= 10V
I
D
, DRAIN CURRE
NT (A)
T
C
,
CASE TEMPERATURE(
o
C)
Fi
gure 3.
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0.
01
0.1
1
SI
NGLE PULSE
D = 0.
50
0.20
0.10
0.05
0.02
0.01
NO
RMALIZED THERMAL
IMPEDANCE, Z
θJC
t
, RECTANGULAR PULSE DURATION(s)
DUTY CYCLE -
DESCENDING ORDER
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θJC
x R
θJC
+ T
C
P
DM
t
1
t
2
N
ormalized Maximum Transient Thermal Impedance
Figure 4. Peak Current Capability
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
10
0
1000
V
GS
= 1
0V
SI
NGLE PULSE
I
DM
, P
EAK CURRENT (A)
t
, RECTANGULAR PULSE DURATION(s)
T
C
=
25
o
C
I =
I
2
1
75 - T
C
15
0
FOR TEMPE
RATURES
ABOVE 25
o
C D
ERATE PEAK
CU
RRENT AS FOLLOWS:

FDMS86568-F085

Mfr. #:
Manufacturer:
ON Semiconductor / Fairchild
Description:
MOSFET 60V 80A Power56 N-Chnl PowerTrench
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet