Data Sheet ADP198
Rev. G | Page 15 of 16
DIODE ORing APPLICATIONS
+
LOAD
6V
AC
V2
V
OUT
=
V2 – (I
LOAD
× R
ON
)
VOUTVIN
EN
ADP198
09484-031
Figure 31. ADP198 in a Typical Diode OR’ing Application
Figure 31 shows an application wherein an ac power supply and
battery are ORed together to provide a seamless transition from
the primary (ac) supply to the secondary (V2) supply when the
primary supply is disconnected. By connecting the enable input
of the ADP198 to V2, the transition from ac power to battery
power is automatic.
Figure 32 shows the forward voltage vs. the forward current
characteristics of a Schottky diode and the ADP198. The low on
resistance of the ADP198 makes it far superior to a Schottky
diode in diode OR’ing applications.
In addition to low on resistance, the ADP198 reverse leakage
current is much lower than a typical 1 A, 20 V Schottky
rectifier. For example, at 85°C, the reverse current of a Schottky
rectifier can be as high as 30 μA with only 2.5 V of reverse bias.
Figure 32 shows that about 75 mV of hysteresis built into the
circuitry that senses the voltage differential between the input
and output voltage. When the difference between the input
voltage and output voltage exceeds 75 mV, the ADP198 is
switched on.
FORWARD VOLTAGE (V)
CURRENT (A)
SCHOTTKY
FORWARD
VOLTAGE
SLOPE =
1
R
ON
75mV (V
HYS
)
300mV
1A
09484-032
Figure 32. Forward Voltage vs. Forward Current of a Schottky
Diode and ADP198
ADP198 Data Sheet
Rev. G | Page 16 of 16
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
0.990
0.950
0.910
1.065
1.025
0.985
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
12
B
BALL A1
IDENTIFIER
0.50
BSC
0.640
0.595
0.550
END VIEW
0.340
0.320
0.300
0.370
0.355
0.340
SEATING
PLANE
0.270
0.240
0.210
COPLANARITY
0.05
06-06-2013-A
PKG-3615
Figure 33. 4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-4)
Dimensions shown in millimeters
1.70
1.60
1.50
0.425
0.350
0.275
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.60
0.55
0.50
1.10
1.00
0.90
0.20 REF
0.15 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
01-14-2013-C
2.10
2.00 SQ
1.90
Figure 34. 8-Lead Lead Frame Chip Scale Package [LFCSP_UD]
2.00 × 2.00 mm Body, Ultra Thin, Dual Lead
(CP-8-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range
Start-Up
Time (μs) Package Description
Package
Option Branding
ADP198ACBZ-R7 −40°C to +85°C 22 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-4 8C
ADP198ACBZ-11-R7 −40°C to +85°C 1100 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-4 2W
ADP198ACPZ-R7 −40°C to +85°C
Pin selectable:
22, 200, 450,
and 1100
8-Lead Lead Frame Chip Scale Package [LFCSP_UD] CP-8-10 LJL
ADP198CP-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
©2011–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09484-0-8/13(G)
www.analog.com/ADP198

ADP198ACBZ-R7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Switch ICs - Power Distribution Logic-Cntrld 1A Hi-Side Load Switch
Lifecycle:
New from this manufacturer.
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