MP3V5004G
Sensors
4 Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic
chip carrier (Case 482A). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MP3V5004G series sensor operating characteristics
are based on the use of dry air as pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the MP3V5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum and maximum output
curves are shown for operation over a temperature range of
10°C to 60°C using the decoupling circuit shown in Figure 3
The output will saturate outside of the specified pressure
range.
Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Recommended Power Supply Decoupling and
Output Filtering.
(For additional output filtering, please refer to Application
Note AN1646.)
Figure 4. Output vs. Pressure Differential at ±2.5% V
FSS
(See Note 5 in Operating Characteristics table)
+3 V
1.0 μF
0.01 μF
470 pFGND
V
s
V
out
IPS
OUTPUT
Fluorosilicone
Gel Die Coat
Differential Sensing
Element
Stainless
Steel Cap
P1
P2
Die Bond
Die
Thermoplas-
tic
Lead
Frame
Wire
Bond
3.0
1.0
2.0
0.6
Max
Min
Typical
Output (V)
2 kPa
200 mm H
2
O
4 kPa
400 mm H
2
O
TRANSFER FUNCTION:
V
out
= V
S
*[(0.2*P) + 0.2] ± 2.5% V
FSS
V
S
= 3.0 V ± 0.30 Vdc
TEMP = 10 to 60°C
MP3V5004G
Sensors
Freescale Semiconductor 5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint
Part Number Case Type Pressure (P1) Side Identifier
MP3V5004GC6U/T1
482A
Side with Port Attached
MP3V5004GP
1369
Side with Port Attached
MP3V5004DP
1351
Side with Part Marking
MP3V5004GVP
1368
Stainless Steel Cap
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1
MP3V5004G
Sensors
6 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0 7 0 7
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
TYPICAL DRAFT.
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010) A
S
T
–A–
–B–
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
–T–
N
V
W
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17

FRDMSTBCDP5004

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Pressure Sensor Development Tools Freedom Sensor Shield Board for the MPXV5004DP. FRDM board, Sensor Toolbox, and ISF compatible
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union