AD9432
Rev. F | Page 7 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
52
V
CC
51
GND
50
AIN
49
AIN
48
GND
47
V
CC
46
VREFOU
45
VREFIN
44
V
CC
43
GND
42
V
CC
41
DNC
40
GND
38
GND
37
V
CC
36
V
CC
33
GND
34
GND
35
GND
39
GND
32
V
DD
31
DGND
30
D0 (LSB)
28
D2
27
D3
29
D1
2
V
CC
3
GND
4
GND
7
ENCODE
6
V
CC
5
V
CC
1
GND
8
ENCODE
9
GND
10
V
CC
12
DGND
13
V
DD
11
GND
NOTES
1. DNC = DO NOT CONNE
T.
14
OR
15
D11 (MSB)
16
D10
17
D9
18
D8
19
D7
20
D6
21
DGND
22
V
DD
23
V
DD
24
DGND
25
D5
26
D4
PIN 1
AD9432
TOP VIEW
(Not to Scale)
00587-002
00587-044
PIN 1
AD9432
TOP VIEW
(Not to Scale)
1
GND
2
V
CC
3
GND
4
GND
5
V
CC
6
V
CC
7
ENCODE
8
ENCODE
9
GND
10
V
CC
11
GND
12
DGND
13
V
DD
14
OR
15
D11 (MSB)
16
D10
17
D9
18
D8
19
D7
20
D6
21
DGND
22
V
DD
23
V
DD
24
DGND
25
D5
26
D4
40
GND
41
DNC
42
V
CC
43
GND
44
V
CC
45
VREFIN
46
VREFOUT
47
V
CC
48
GND
49
AIN
50
AIN
51
GND
52
V
CC
27
D3
28
D2
29
D1
30
D0 (LSB)
31
DGND
32
V
DD
33
GND
34
GND
35
GND
36
V
CC
37
V
CC
38
GND
39
GND
NOTES
1. ALTHOUGH NOT REQUIRED IN ALL APPLICATIONS, THE EXPOSED PADDLE
ON THE UNDERSIDE OF THE PACKAGE SHOULD BE SOLDERED TO THE
GROUND PLANE. SOLDERING THE EXPOSED PADDLE TO THE PCB
INCREASES THE RELIABILITY OF THE SOLDER JOINTS, MAXIMIZING
THE THERMAL CAPABILITY OF THE PACKAGE.
Figure 3. Pin Configuration, LQFP Figure 4. Pin Configuration, TQFP_EP
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 9, 11, 33,
34, 35, 38, 39, 40,
43, 48, 51
GND Analog Ground.
2, 5, 6, 10, 36, 37,
42, 44, 47, 52
V
CC
Analog Supply (5 V).
7
ENCODE
Encode Clock for ADC, Complementary.
8 ENCODE Encode Clock for ADC, True. ADC samples on rising edge of ENCODE.
12, 21, 24, 31 DGND Digital Output Ground.
13, 22, 23, 32 V
DD
Digital Output Power Supply (2.7 V to 3.6 V).
14 OR Out-of-Range Output.
15 to 20, 25 to 30 D11 to D6, D5 to D0 Digital Output.
41 DNC Do Not Connect.
45 VREFIN Reference Input for ADC (2.5 V Typical). Bypass with 0.1 μF capacitor to ground.
46 VREFOUT Internal Reference Output (2.5 V Typical).
49 AIN Analog Input, True.
50
AIN
Analog Input, Complementary.
Exposed Pad
(TQFP_EP)
Although not required in all applications, the exposed paddle on the underside of the TQFP_EP
package should be soldered to the ground plane. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the thermal capability of the package.