ADG904 Data Sheet
Rev. D | Page 12 of 16
EVALUATION BOARD
The ADG904/ADG904-R evaluation board allows designers
to evaluate the high performance, wideband switches with
minimal effort.
Only a power supply and a network analyzer, along with the
evaluation board, are required to demonstrate that these devices
meet user requirements. An application note, available with the
evaluation board, provides complete operating information.
The RFC port (see Figure 30) is connected through a 50 Ω
transmission line to the bottom left SMA connector, J4. RF1,
RF2, RF3, and RF4 are connected through 50 Ω transmission
lines to SMA connectors J5, J6, J7, and J8, respectively. A through
transmission line connects J9 and J10; this transmission line
is used to estimate the loss of the PCB over the environmental
conditions being evaluated.
The board is constructed of four-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062 inches.
Two ground layers with grounded planes provide ground for
the RF transmission lines. The transmission lines were designed
using a coplanar waveguide with a ground plane model using
a trace width of 0.024 inches, clearance to ground plane of
0.008 inches, dielectric thickness of 0.02 inches, and a metal
thickness of 0.0021 inches.
04504-0-024
Figure 30. ADG904/ADG904-R Evaluation Board Top View
Data Sheet ADG904
Rev. D | Page 13 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AC
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
0
°
COPLANARITY
0.10
Figure 31. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOPVIEW
EXPOSED
PAD
P
I
N
1
INDIC
A
TOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Figure 32. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ADG904 Data Sheet
Rev. D | Page 14 of 16
ORDERING GUIDE
Model
1, 2
Temperature Range
Package Description
Package Option
ADG904BCPZ 40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG904BCPZ-REEL 40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG904BCPZ-REEL7 40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG904BRUZ 40°C to +85°C 20-Lead Thin Shrink Small Outline Package [TSSOP] RU-20
ADG904BRUZ-R 40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADG904BRUZ-REEL7 40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
ADW54011Z-0REEL7 40°C to +85°C 20-Lead Thin Shrink Small Outline Package (TSSOP) RU-20
EVAL-ADG904EBZ Evaluation Board
EVAL-ADG904REBZ Evaluation Board
1
Z = RoHS compliant part.
2
W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADW54011Z model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade product shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for this model.

ADW54011Z-0REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Switch ICs 2.5GHz 4:1 Mux/SP4T CMOS 1.65-2.75V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union