For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
LINEAR & POWER AMPLIFIERS - SMT
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11 - 93
Recommended SMT Attachment Technique
Preparation & Handling of the LM1 Microwave Package for Surface Mounting
The HMC LM1 package was designed to be compatible with high volume
surface mount PCB assembly processes. The LM1 package requires a
speci c mounting pattern to allow proper mechanical attachment and to
optimize electrical performance at millimeterwave frequencies. This PCB
layout pattern can be found on each LM1 product data sheet. It can also
be provided as an electronic drawing upon request from Hittite Sales &
Application Engineering.
Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure clean devices
and PCBs. LM1 devices should remain in their original packaging until
component placement to ensure no contamination or damage to RF, DC &
ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
General Handling: Handle the LM1 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers.
Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid.
Solder Materials & Temperature Pro le: Follow the information contained in the application note. Hand soldering is not recommended.
Conductive epoxy attachment is not recommended.
Solder Paste: Solder paste should be selected based on the user’s experience and be compatible with the metallization systems
used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application: Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of
solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical
performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Re ow: The soldering process is usually accomplished in a re ow oven but may also use a vapor phase process. A solder
re ow pro le is suggested above.
Prior to re owing product, temperature pro les should be measured using the same mass as the actual assemblies. The thermo-
couple should be moved to various positions on the board to account for edge and corner effects and varying component masses.
The nal pro le should be determined by mounting the thermocouple to the PCB at the location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder re ow pro le. A standard pro le will have a
steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time
between reaching pre-heat temperature and re ow for the solvent in the paste to evaporate and the ux to completely activate.
Re ow must then occur prior to the ux being completely driven off. The duration of peak re ow temperature should not exceed
15 seconds. Packages have been quali ed to withstand a peak temperature of 235°C for 15 seconds. Verify that the pro le will not
expose device to temperatures in excess of 235°C.
Cleaning: A water-based ux wash may be used.
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TEMPERATURE (
0
C)
TIME (min)
HMC441LM1
v02.0508
GaAs PHEMT MMIC MEDIUM
POWER AMPLIFIER, 7 - 15.5 GHz
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
