AD8628/AD8629/AD8630 Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 6 V
S
Differential Input Voltage
1
±5.0 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
ESD AD8628
HBM 8-Lead SOIC ±7000V
FICDM 8-Lead SOIC ±1500V
FICDM 5-Lead TSOT ±1000V
MM 8-Lead SOIC ±200V
ESD AD8629
HBM 8-Lead SOIC ±4000V
FICDM 8-Lead SOIC ±1000V
ESD AD8630
HBM 14-Lead SOIC ±5000V
FICDM 14-Lead TSSOP ±1500V
MM 14-Lead SOIC ±200V
1
Differential input voltage is limited to ±5 V or the supply voltage, whichever
is less.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
θ
JA
is specified for worst-case conditions, that is, θ
JA
is specified
for the device soldered in a circuit board for surface-mount
packages. This was measured using a standard two-layer board.
Table 4.
Package Type θ
JA
θ
JC
Unit
5-Lead TSOT (UJ-5) 207 61 °C/W
5-Lead SOT-23 (RJ-5) 230 146 °C/W
8-Lead SOIC_N (R-8) 158 43 °C/W
8-Lead MSOP (RM-8) 190 44 °C/W
14-Lead SOIC_N (R-14) 105 43 °C/W
14-Lead TSSOP (RU-14) 148 23 °C/W
ESD CAUTION
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