TSH151ID

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TSH151
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TEST WAVEFORM EVALUATION CIRCUIT
PRINTED CIRCUIT LAYOUT
As for any high frequency device, a few rules must
be observed when designing the PCB to get the
best performances from this high speed op amp.
From the most to the least important points :
Each power supply lead has to be by-
passed to ground with a 10nF ceramic ca-
pacitor very close to the device and a 10µF
tantalum capacitor.
To provide low inductance and low resist-
ance common return, use a ground plane
or common point return for power and sig-
nal.
All leads must be wide and as short as pos-
sible especially for op amp inputs. This is in
order to decrease parasitic capacitance
and inductance.
Use small resistor values to decrease time
constant with parasitic capacitance.
Choose component sizes as small as pos-
sible (SMD).
On output, decrease capacitor load so as
to avoid circuit stability being degraded
which may cause oscillation. You can also
add a serial resistor in order to minimise its
influence.
One can add in parallel with feedback re-
sistor a few pF ceramic capacitor C
F
adjust-
ed to optimize the settling time.
V
in
50%
t
d
t
r
90%
t
s
0.1% of edge amplitude
10%
Input
50
1k
1k
10nF
10µF
C
F
-5V
+5V
10nF
10
µ
F
50
Output
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TSH151
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MACROMODEL
Applies to: TSH151I
** Standard Linear Ics Macromodels, 1993.
** CONNECTIONS :
* 1 INVERTING INPUT
* 2 NON-INVERTING INPUT
* 3 OUTPUT
* 4 POSITIVEPOWER SUPPLY
* 5 NEGATIVE POWER SUPPLY
.SUBCKT TSH151 1 3 2 4 5 (analog)
********************************************************
.MODEL MDTH D IS=1E-8 KF=3.322525E-14
CJO=10F
* INPUT STAGE
RESD1 2 202 150
RESD2 1 201 150
CIP 202 5 10.000000E-12
CIN 201 5 10.000000E-12
EIP 10 5 202 5 1
EIN 16 5 201 5 1
RIP 10 11 2.600000E-01
RIN 15 16 2.600000E-01
RIS 11 15 1.683423E-01
DIP 11 12 MDTH 400E-12
DIN 15 14 MDTH 400E-12
VOFP 12 13 DC 0.000000E+00
VOFN 13 14 DC 0
IPOL 13 5 1.000000E-03
CPS 11 15 8E-09
DINN 17 13 MDTH 400E-12
VIN 17 5 1.500000e+00
DINR 15 18 MDTH 400E-12
VIP 4 18 5.000000E-01
FCP 4 5 VOFP 2.200000E+01
FCN 5 4 VOFN 2.200000E+01
* AMPLIFYING STAGE
FIP 5 19 VOFP 3.800000E+02
FIN 5 19 VOFN 3.800000E+02
RG1 19 5 1.455096E+03
RG2 19 4 1.455096E+03
CC 19 29 2.000000E-09
HZTP 29 30 VOFP 100
HZTN 30 5 VOFN 100
DOPM 19 22 MDTH 400E-12
DONM 21 19 MDTH 400E-12
HOPM 22 28 VOUT 5.000000E+02
VIPM 28 4 5.000000E+01
HONM 21 27 VOUT 5.000000E+02
VINM 5 27 5.000000E+01
EOUT 26 23 19 5 1
VOUT 23 5 0
ROUT 26 3 9.978126E+00
COUT 3 5 1.000000E-13
DOP 19 25 MDTH 400E-12
VOP 4 25 1.946965E+00
DON 24 19 MDTH 400E-12
VON 24 5 1.946965E+00
.ENDS
ELECTRICAL CHARACTERISTICS
V
CC
= ±5V, T
amb
= 25°C (unless otherwise specificed)
Symbol Conditions Value Unit
V
io
0mV
A
vd
R
L
= 100
1.18 V/mV
I
CC
No load 23 mA
V
icm
-5 to 2.5 V
V
OH
R
L
= 100
+3.6 V
V
OL
R
L
= 100
-3.6 V
I
sink
V
o
= 0V
108 mA
I
source
V
o
= 0V
108 mA
GBP
R
L
= 100
, C
L
= 15pF
130 MHz
SR
R
L
= 100
, C
L
= 15pF
172 V/
µ
s
φ
m
R
L
= 100
, C
L
= 15pF
25 Degrees
t
s
A
v
= -1 at 0.1%
40 ns
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consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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PACKAGE MECHANICAL DATA
8 PINS - PLASTIC MICROPACKAGE (SO)
Dim.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 1.75 0.069
a1 0.1 0.25 0.004 0.010
a2 1.65 0.065
a3 0.65 0.85 0.026 0.033
b 0.35 0.48 0.014 0.019
b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.020
c1 45° (typ.)
D 4.8 5.0 0.189 0.197
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 3.81 0.150
F 3.8 4.0 0.150 0.157
L 0.4 1.27 0.016 0.050
M 0.6 0.024
S 8° (max.)
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TSH151ID

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Operational Amplifiers - Op Amps Single Wide Bandwdth
Lifecycle:
New from this manufacturer.
Delivery:
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