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DB2L33400L1

P1-P3P4-P6P7-P9
Product Standards
Schottky Barrier Diode
DB2L33400L1
(Waveform definition)
(Graph legends)
(Waveform definition)
(Graph legends)
Page
Electrical Characteristics Technical Data (Reference)
PF(AV) - IF(AV) / Typical Data
Average Forward Power Dissipation : PF(AV) [W]
PR(AV) - VR / Typical Data
(1) σ= 1.0
(2) σ= 0.8
(3) σ= 0.5
(4) σ= 0.3
A
verage Forward Current : IF(AV) [A]
Average Reverse Power Dissipation : PR(AV) [W]
(1) σ= 1.0
Reverse Voltage : VR [V]
4of8
(2) σ= 0.7
(3) σ= 0.5
(4) σ= 0.2
VR
T
Tp
Time
Tj = 125°C
(1)
(2)
(4)
(3)
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0 5 10 15 20 25 30 35
Tj = 150°C
(1)
(3)
(2)
(4)
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Tp
T
Duty Cycle : σ =
Tp
T
Duty Cycle : σ =
IF
T
Tp
Time
TT4-EA-15067
Revision.
1
Established
:
2015-10-13
Revised
:
####-##-##
Product Standards
Schottky Barrier Diode
DB2L33400L1
Note) *1:
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (27.6mm
2
area, 36μm thick).
*2:
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (108.0mm
2
area, 36μm thick).
(Evaluation board outline)
Note) *1: Single pulse measurement
(Graph legends)
(Waveform definition)
Page
Thermal Characteristics
(1)
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick),
copper wiring (27.6mm
2
area, 36μm thick).
-
Unit
Parameter
Symbol Conditions Min Typ Max
R
th(j-a)
Ta = 25℃, in free air
Thermal Resistance : Rth [℃/W]
35
5of8
610 -
A
pplying Time : T [s]
°C/W
°C/W-
Thermal Characteristics Technical Data (Reference)
(2)
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick),
copper wiring (108.0mm
2
area, 36μm thick).
-
-
-
°C/W
Rth - T
*
1
/ T
yp
ical Data
R
th(j-sp)
Ta = 25℃, in free air
Thermal Resistance, Junction to Solder Point
Thermal Resistance, Junction to Ambient
*1
R
th(j-a)
Ta = 25℃, in free air
202
Thermal Resistance, Junction to Ambient
*2
(1)
(2)
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Power
Applying Time : T
Time
25.4mm
25.4mm
Copper wiring
(27.6mm
2
)
FR4 PCB
25.4mm
25.4mm
Copper wiring
(108.0mm
2
)
FR4 PCB
TT4-EA-15067
Revision.
1
Established
:
2015-10-13
Revised
:
####-##-##
Product Standards
Schottky Barrier Diode
DB2L33400L1
(Evaluation board outline)
(Waveform definition)
(Graph legends)
(Evaluation board outline)
(Waveform definition)
(Graph legends)
Note) *1:
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (27.6mm
2
area, 36μm thick).
*2:
Device mounted on a FR4 PCB (25.4mm×25.4mm, 1mm thick), copper wiring (108.0mm
2
area, 36μm thick).
Page
0.02
σ = 0
σ = 0.5
σ = 0.2
σ = 0.1
σ = 0.05
6of8
(4)
(1)
(2)
(6)
0.1
0.05
0.02
0
σ =
σ =
σ =
σ =
0.5
Tp [s]
σ =
σ =
Tp [s]
Effective Transient Thermal Resistance - T
p
*
2
/ T
yp
ical Data
0.2
Thermal Characteristics Technical Data (Reference)
Effective Transient Thermal Resistance [℃/W]
(5)
Effective Transient Thermal Resistance - T
p
*
1
/ T
yp
ical Data
(3)
Effective Transient Thermal Resistance [℃/W]
(2)
(3)
(4)
(1)
(5)
(6)
σ =
(6)
(1)
(2)
(3)
(4)
(5)
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
(6)
(1)
(2)
(3)
(4)
(5)
10
100
0.0001 0.001 0.01 0.1 1 10 100 1000
Power
T
Tp
Time
Tp
T
Duty Cycle : σ =
Power
T
Tp
Time
Tp
T
Duty Cycle : σ =
TT4-EA-15067
Revision.
1
Established
:
2015-10-13
Revised
:
####-##-##
P1-P3P4-P6P7-P9

DB2L33400L1

Mfr. #:
Buy DB2L33400L1
Manufacturer:
Panasonic
Description:
Schottky Diodes & Rectifiers WL CSP Low VF 30V Schottky Diode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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