Products and specifications discussed herein are subject to change by Micron without notice.
256MB, 512MB (x72, ECC, SR) 184-Pin DDR SDRAM RDIMM
Features
PDF: 09005aef8082c948/Source: 09005aef807d56a1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
ddf9c32_64x72.fm - Rev. C 10/08 EN
1 ©2002 Micron Technology, Inc. All rights reserved.
DDR SDRAM RDIMM
MT9VDDF3272 – 256MB
MT9VDDF6472 – 512MB
For component data sheets, refer to Micron’s Web site: www.micron.com
Features
• 184-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC2100, PC2700, or PC3200
• 256MB (32 Meg x 72) and 512MB (64 Meg x 72)
• Supports ECC error detection and correction
•V
DD = VDDQ = +2.5V
(-40B: V
DD = VDDQ = +2.6V)
•V
DDSPD = +2.3V to +3.6V
• 2.5V I/O (SSTL_2-compatible)
• Internal, pipelined double data rate (DDR)
2n-prefetch architecture
• Bidirectional data strobe (DQS) transmitted/received
with data—that is, source-synchronous data capture
• Differential clock inputs (CK and CK#)
• Multiple internal device banks for concurrent
operation
• Single rank
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
maximum average periodic refresh interval
• Serial presence-detect (SPD) with EEPROM
• Selectable CAS latency (CL) for maximum
compatibility
• Gold edge contacts
184-Pin RDIMM (MO-206) Figures
Figure 1: R/C G (-40B, -335, -265)
PCB height: 28.58mm (1.125in)
Figure 2: R/C A (-335, -262, -26A -265)
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. CL = CAS (READ) latency; registered mode will
add one clock cycle to CL.
Options Marking
• Operating temperature
1
– Commercial (0°C ≤ T
A
≤ +70°C) None
– Industrial (–40°C ≤ T
A
≤ +85°C) I
•Package
– 200-pin DIMM (standard) G
– 200-pin DIMM (Pb-free) Y
• Memory clock, speed, CAS latency
2
– 5ns (200 MHz), 400 MT/s, CL = 3 -40B
– 6ns (166 MHz), 333 MT/s, CL = 2.5 -335
– 7.5ns (133 MHz), 266 MT/s, CL = 2 -262
– 7.5ns (133 MHz), 266 MT/s, CL = 2 -26A
– 7.5ns (133 MHz), 266 MT/s, CL = 2.5 -265
PCB height: 28.58mm (1.125in)