POWERDI is a registered trademark of Diodes Incorporated
DMP26M7UFG
Document number: DS37944 Rev. 1 - 2
April 2015
© Diodes Incorporated
ADVANCE INFO R MA T I O N
ADVANCE INFO R MA T I O N
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Continuous Drain Current (Note 5) V
GS
= -4.5V
T
A
= +25°C
T
A
= +70°C
T
C
= +25°C
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Maximum Continuous Body Diode Forward Current (Note 5)
Avalanche Current (Note 7) L=0.1mH
Avalanche Energy (Note 7) L=0.1mH
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
ON CHARACTERISTICS (Note 8)
V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance
DYNAMIC CHARACTERISTICS (Note 9)
V
DS
= -10V, V
GS
= 0V
f = 1.0MHz
Reverse Transfer Capacitance
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= -4.5V)
Total Gate Charge (V
GS
= -10V)
V
GS
= -4.5V, V
DD
= -10V,
R
G
= 1Ω, I
D
= -10A
I
F
= -10A, di/dt = 100A/µs
I
F
= -10A, di/dt = 100A/µs
Notes: 5. R
θJA
is determined with the device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. R
θJC
is guaranteed by design
while R
θJA
is determined by the user’s board design.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7 .UIS in production with L =0.1mH, T
J
= +25°C
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.