Mechanical data PD55008L-E
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5 Mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
PD55008L-E Mechanical data
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Figure 6. Package dimensions
Table 10. PowerFLAT™ Mechanical data
Dim. mm. Inch
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.00 0.035 0.039
A1 0.02 0.05 0.001 0.002
A3 0.24 0.009
AA 0.15 0.25 0.35 0.006 0.01 0.014
b 0.43 0.51 0.58 0.017 0.020 0.023
c 0.64 0.71 0.79 0.025 0.028 0.031
D5.00 0.197
d0.30 0.011
E5.00 0.197
E2 2.49 2.57 2.64 0.098 0.101 0.104
e1.27 0.050
f3.37 0.132
g 0.74 0.03
h0.21 0.008
Mechanical data PD55008L-E
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Figure 7. Recommended footprint

PD55008L-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
RF MOSFET Transistors RF POWER transistor LDMOST family N-Chan
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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