MMBD3004CA RFG

Small Signal Product
- Fast switching speed
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate
- Pb free version and RoHS compliant
- Packing code with suffix "G" means
green compound (halogen-free)
- Case: SOT-23 small outline plastic package
- Weight: 8 ± 0.5 mg
SYMBOL UNIT
P
D
mW
V
RRM
V
I
FRM
mA
I
O
mA
R
θJA
o
C/W
T
J
, T
STG
o
C
SYMBOL UNIT
Reverse Breakdown Voltage
V
(BR)
V
C
J
pF
Reverse Recovery Time
I
F
=I
R
=30mA, R
L
=100, I
RR
=0.1I
R
t
rr
ns
Document Number: DS_S1501010 Version: B15
VALUE
MMBD3004/CA/CC/SE
Taiwan Semiconductor
350mW, SMD Switching Diode
FEATURES
SOT-23
MECHANICAL DATA
Power Dissipation 350
350
V
F
- Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed : 260°C/10s
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER
A
1
357
625
225
Repetitive Peak Reverse Voltage
-65 to +150
MIN MAX
Mean Forward Current
Repetitive Peak Forward Current
4
350 -
Forward Voltage
-1.00
I
F
=200mA
I
F
=100mA
I
R
=100μA
V
-1.25
Reverse Leakage Current
-0.1
μA
V
R
=240V
100
Junction Capacitance -5
V
R
=1V, f=1.0MHz
V
R
=240V, T
J
=150
o
C
I
R
-50
PARAMETER
I
FSM
Non-Repetitive Peak Forward
Surge Current
Pulse Width=1s
Pulse Width=1μs
Junction and Storage Temperature Range
Thermal Resistance (Junction to Ambient)
-
Small Signal Product
(T
A
=25°C unless otherwise noted)
Document Number: DS_S1501010 Version: B15
MMBD3004/CA/CC/SE
Taiwan Semiconductor
RATINGS AND CHARACTERISTICS CURVES
0.001
0.01
0.1
1
10
100
1000
00.511.522.533.5
Instantaneous Reverse Current (mA)
Instantaneous Reverse Voltage (V)
Fig. 2 Typical Reverse Characteristics
0.7
0.8
0.9
1.0
1.1
0.01 0.1 1 10 100
C
T
, Total Capacitance (pF)
Reverse Voltage (V)
Fig. 4 Typical Capacitance VS. Reverse Voltage
0
50
100
150
200
250
300
350
400
0 25 50 75 100 125 150 175 200
Power Dissipation (mW)
Ambient Temperature (
o
C)
Fig. 3 Admissible Power Dissipation Curve
0.01
0.1
1
10
100
1000
0 0.3 0.6 0.9 1.2 1.5 1.8 2.1
Instantaneous Forward Current (mA)
Instantaneous Forward Voltage (V)
Fig. 1 Typical Forward Characteristics
PACKAGE OUTLINE DIMENSIONS
Min Max Min Max
A 2.70 3.10 0.106 0.122
B 1.10 1.50 0.043 0.059
C 0.30 0.51 0.012 0.020
D 1.78 2.04 0.070 0.080
E 2.10 2.64 0.083 0.104
F 0.89 1.30 0.035 0.051
G
H
SUGGEST PAD LAYOUT
Z
X
Y
C
E
PIN CONFIGURATION
MARKING
Marking
HC
RA
PZ
PY
Document Number: DS_S1501010 Version: B15
1.0 0.039
ORDER INFORMATION (EXAMPLE)
Part No.
SOT-23
0.7 0.028
0.9 0.035
1.9 0.075
DIM.
Unit (mm) Unit (inch)
Typ. Typ.
2.8 0.110
DIM.
Unit (mm) Unit (inch)
0.55 REF 0.022 REF
0.10 REF 0.004 REF
MMBD3004
MMBD3004CA
MMBD3004CC
MMBD3004SE
MMBD3004/CA/CC/SE
Taiwan Semiconductor
Small Signal Product
MMBD3004 RFG
Green compoundcode
Packingcode
Partno.

MMBD3004CA RFG

Mfr. #:
Manufacturer:
Taiwan Semiconductor
Description:
Diodes - General Purpose, Power, Switching 350mW SMD Switch Diode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet