RESP_IRR_20 P Package 110-901
January 2017
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the SPEC Copyright © 2011-2017, SPEC Sensors LLC
Sensors standard warranty. Production processing does not
necessarily include testing of all parameters.
SENSOR STORAGE, HANDLING AND SOLDERING
This information embodies various general recommendations concerning the storage, handling, and manual soldering
conditions for SPEC SENSORS CSPEC Modules. It is only applicable for modules guaranteed by SPEC SENSORS
stated in SPEC SENSORS Sensor Specification Sheet. Moreover, SPEC SENSORS' modules are NOT warranted
and should NOT be used in high temperature soldering (reflow) or pre-tinning baths.
Sensor & Module Handling
Handle sensors with care. Take precautions, including but not limited to the following:
A. DO NOT apply excessive pressure to the top or bottom of the sensor module.
B. Whenever possible, handle or make contact with the sensor module from the sides of the PCB or substrate.
C. Light vacuum pressure is possible during handling, DO NOT apply vacuum over gas sensor port.
D. If the sealed sensor package is opened, DO NOT re-seal using vacuum or nitrogen gas. DO NOT reseal with
desiccant.
E. DO NOT obstruct the gas sensor port by making direct contact with any tape, apparatus, weights, etc.
F. DO NOT use silicone or other conformal coatings around the sensor or gas port-holes.
G. Operators are requested to wear powder free antistatic gloves.
Manufacturing Assembly Floor Environment
SPEC SENSORS recommends that the manufacturing assembly floor environment be maintained at controlled
conditions:
A. Temperature: 18 - 26°C
B. Relative Humidity: 40 to 60%
C. Pressure: 1.0 ± 0.2 atm
Sensor & Module Storage Conditions
The shelf life for sealed, packaged components is 12 months from the pack seal date, when stored in the factory -
sealed bag under the following conditions:
A. Temperature: 5 to 25 °C
B. Relative Humidity: 20 to 80%
C. Pressure: 1.0 ± 0.2 atm
D. Storage Time: 12 months
When moving from Storage Conditions to the Manufacturing Assembly Floor Environment, the sensors should be
allowed to equilibrate at the new conditions for at least 24 hours prior to manufacturing.
Module Attach Soldering Process
Hand solder only. Keep the soldering iron or solder process tool away from the sensor. The sensor should not see
pre-heat temperatures above 70 °C. There have been suggested cases where a heat sink cover over the sensor may
be applicable to protect the sensor during processing. No Application notes to this approach available. Only to be
used as reference only.
A. DO NOT heat sensor above 70 °C
B. Hand or peripheral process type approach
C. Use solder wire alloy with the lowest possible eutectic temperature
D. Use lowest possible soldering iron temperature
E. Contact the host board with the soldering iron at a 45° angle on the solder pad
F. Keep the soldering iron away from the top and bottom of the sensor module
G. DO NOT place in reflow, wave or IR reflow type processes
H. DO NOT place mounted board In a wash
