NFR0300004707JAC00

www.vishay.com For technical questions, contact: filmresistors.leaded@vishay.com Document Number: 30256
4 Revision: 06-Dec-07
NFR01, NFR02, NFR03
Vishay BCcomponents
Fusible Power Metal Film Leaded
Resistors
APPLICATION INFORMATION
NFR01
NFR02
Hot Spot Solder Spot
Hot spot temperature rise (ΔT) as a function
of dissipated power
Temperature rise (ΔT) at the lead end (soldering
point) as a function of dissipated power at various leads
lengths after mounting
Hot Spot Solder Spot
Hot spot temperature rise (ΔT) as a function
of dissipated power
Temperature rise (ΔT) at the lead end (soldering
point) as a function of dissipated power at various leads
lengths after mounting
0
20
40
60
80
100
120
140
160
0 0.2 0.4 0.6 0.8 1.0
Δ
(°C)
T
(W)
P
Ø 0.58 mm Cu
0
10
20
030
40
50
60
0 0.2 0.4 0.6 0.8 1.0 1.2
Δ
(°C)
T
15 mm
20 mm
25 mm
Ø 0.58 mm Cu
(W)
P
0
20
40
60
80
100
120
140
160
0 0.5 1.0 1.5 2.0
Δ
(°C)
T
Ø 0.80 mm Cu
(W)
P
0
20
40
60
80
100
0 0.5 1.0 1.5 2.0
Δ
(°C)
T
15 mm
Ø 0.80 mm Cu
20 mm
25 mm
(W)
P
Document Number: 30256 For technical questions, contact: filmresistors.leaded@vishay.com
www.vishay.com
Revision: 06-Dec-07 5
NFR01, NFR02, NFR03
Fusible Power Metal Film Leaded
Resistors
Vishay BCcomponents
NFR03
FUSING CHARACTERISTIC
The resistors will fuse without the risk of fire and within an indicated range of overload. Fusing means that the resistive value of
the resistor increases at least 100 times.
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the schedule of IEC 60115-1, category 55/155/56 (rated temperature range
- 55 to + 155 °C; damp heat, long term, 56 days) and along the lines of IEC 60068-2; “Recommended basic climatic and
mechanical robustness testing procedure for electronic components” and under standard atmosphere conditions according to
IEC 60068-1 subclause 5.3, unless otherwise specified. In some instances deviations from IEC applications were necessary for
our specified method.
Hot Spot Solder Spot
Hot spot temperature rise (ΔT) as a function
of dissipated power
Temperature rise (ΔT) at the lead end (soldering
point) as a function of dissipated power at various leads
lengths after mounting
Resistance Range Power Overload Fusing Time
0.47 Ω - 10 Ω≥ 20 x maximum dissipation at 70 °C (Pn)
60 s
10.1 Ω - 1 kΩ≥ 16 x maximum dissipation at 70 °C (Pn)
0
20
40
60
80
0100
120
140
160
180
0 0.5 1.0 1.5 2.0 2.5 3.0
(W)
Δ
(°C)
T
Ø 0.80 mm Cu
P
0
20
40
60
80
100
0 0.5 1.0 1.5 2.0
Δ
(°C)
T
Ø 0.80 mm Cu
2.5 3.0
25 mm
15 mm
20 mm
(W)
P
PERFORMANCE
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
NFR01 NFR02 NFR03
4.8 -
Temperature
coefficient
Between
- 55 °C and + 155 °C
± 200 ppm/K
4.25.1 - Endurance at 70 °C
1000 h;
loaded with Pn or V
max.
;
1.5 h ON; 0.5 h OFF
± (5 % R + 0.1 Ω)
4.26 - Accidental overload
Overload of 5, 10, 16, 25, 40, 63
and 100 times the rated power,
but the applied voltage shall not
exceed four times the limiting
voltage.
Non-flammable
www.vishay.com For technical questions, contact: filmresistors.leaded@vishay.com Document Number: 30256
6 Revision: 06-Dec-07
NFR01, NFR02, NFR03
Vishay BCcomponents
Fusible Power Metal Film Leaded
Resistors
4.24 3 (Ca)
Damp heat,
steady state
56 days; 40 °C;
90 to 95 % RH
loaded with 0.01 Pn
R
ins
min. 10
3
MΩ
± (3 % R + 0.1 Ω)
4.16 21 (U)
Robustness of
terminations:
No damage
± (0.5 % R + 0.05 Ω)
4.16.2 21 (Ua1) Tensile all samples Load 10 N; 10 s
4.16.3 21 (Ub)
Bending half number
of samples
Load 5 N; 4 x 90°
4.16.4 21 (Uc)
Torsion other half of
samples
3 x 360° in opposite direction
4.19 14 (Na)
Rapid change of
temperature
30 min at LCT;
30 min at UCT;
LCT = - 55 °C;
UCT = 155 °C;
5 cycles
± (1 % R + 0.05 Ω (1 % R + 0.05 Ω (2 % R + 0.05 Ω)
4.23 Climatic sequence
R
ins
min. 10
3
MΩ
± (3 % R + 0.1 Ω)
4.23.2 2 (Ba) Dry heat 16 h, 155 °C
4.23.3 30 (Db)
Damp heat
(accelerated)
24 h; 25 °C to 55 °C
90 % to 100 % RH; 1 cycle
4.23.4 1 (Aa) Cold 2 h, - 55 °C
4.23.6 30 (Db)
Damp heat,
(accelerated)
remaining cycles
5 days; 25 °C to 55 °C
90 to 100 % RH
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 500 Hz;
displacement 1.5 mm or
acceleration 10 g;
6 h (3 x 2 h)
No visual damage
± (0.5 % R + 0.05 Ω)
4.17 20 (Ta)
Solderability
(after ageing)
16 h at 155 °C;
immersed in flux 600,
leads immersed 2 mm in
solder bath at
(235 ± 5) °C for
(2 ± 0.5) s
Good tinning
(95% covered);
no visible damage
4.18 20 (Tb)
Resistance to
soldering heat
Solder bath method;
(350 ± 10) °C;
6 mm from body;
for 3 s
± (1 % R + 0.05 Ω)
4.29 45 (XA)
Component solvent
resistance
Isopropyl alcohol;
MIL STD 202E
No visible damage
4.7 -
Voltage proof on
insulation
500 V
RMS
during 1 min,
V-block method
No flashover or breakdown
4.6.1.1 - Insulation resistance
500 V
DC
during 1 min,
V-block method
R
ins
min. 10
4
MΩ
PERFORMANCE
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
NFR01 NFR02 NFR03

NFR0300004707JAC00

Mfr. #:
Manufacturer:
Vishay
Description:
RES 0.47 OHM 3W 5% AXIAL
Lifecycle:
New from this manufacturer.
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