www.vishay.com
10
Document Number: 71763
S11-0598-Rev. F, 25-Apr-11
Vishay Siliconix
DG417L, DG418L, DG419L
This datasheet is subject to change without notice.
THE PRODUCT DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEST CIRCUITS
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-
nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see www.vishay.com/ppg?71763
.
Figure 7. Off Isolation
R
L
50 Ω
COM
0 V, 2.4 V
R
g
= 50 Ω
GND V-
C
Off Isolation = 20 log
V
COM
V
NO/NC
IN
C
NO or NC
C
C = RF Bypass
V-
V+
V
L
Figure 8. Source/Drain Capacitances
NO or NC
IN
COM
V
L V+
GND V-
C
0 V, 2.4 V
Meter
HP4192A
Impedance
Analyzer
or Equivalent
CC
V-
f = 1 MHz
V+
V
L
Vishay Siliconix
Package Information
Document Number: 71192
11-Sep-06
www.vishay.com
1
DIM
MILLIMETERS INCHES
Min Max Min Max
A 1.35 1.75 0.053 0.069
A
1
0.10 0.20 0.004 0.008
B 0.35 0.51 0.014 0.020
C 0.19 0.25 0.0075 0.010
D 4.80 5.00 0.189 0.196
E 3.80 4.00 0.150 0.157
e 1.27 BSC 0.050 BSC
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.020
L 0.50 0.93 0.020 0.037
q0°8°0°8°
S 0.44 0.64 0.018 0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
4
3
1
2
5
6
8
7
HE
h x 45
C
All Leads
q
0.101 mm
0.004"
L
BA
1
A
e
D
0.25 mm (Gage Plane)
SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
S
NOTES:
1. Die thickness allowable is 0.203"0.0127.
2. Dimensioning and tolerances per ANSI.Y14.5M-1994.
3. Dimensions “D” and “E
1
” do not include mold flash or protrusions, and are
measured at Datum plane -H- , mold flash or protrusions shall not exceed
0.15 mm per side.
4. Dimension is the length of terminal for soldering to a substrate.
5. Terminal positions are shown for reference only.
6. Formed leads shall be planar with respect to one another within 0.10 mm at
seating plane.
7. The lead width dimension does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the lead width
dimension at maximum material condition. Dambar cannot be located on the
lower radius or the lead foot. Minimum space between protrusions and an
adjacent lead to be 0.14 mm. See detail “B” and Section “C-C”.
8. Section “C-C” to be determined at 0.10 mm to 0.25 mm from the lead tip.
9. Controlling dimension: millimeters.
10. This part is compliant with JEDEC registration MO-187, variation AA and BA.
11. Datums -A- and -B- to be determined Datum plane -H- .
12. Exposed pad area in bottom side is the same as teh leadframe pad size.
5
N N-1
A B C 0.20
(N/2) Tips)
2X
N/221
0.60
0.50
0.60
E
Top View
e
See Detail “B”
-H-
3
D
-A-
Seating Plane
A
1
A
6
C0.10
Side View
0.25
BSC
T
4
L
-C-
Seating Plane
0.07 R. Min
2 Places
Parting Line
Detail “A”
(Scale: 30/1)
0.48 Max
Detail “B”
(Scale: 30/1)
Dambar Protrusion
7
C0.08
M
B
S
A
S
b
b
1
With Plating
Base Metal
c
1
c
Section “C-C”
Scale: 100/1
(See Note 8)
See Detail “A”
A
2
0.05
S
C
C
ς
3
E
1
-B-
End View
e1
0.95
Package Information
Vishay Siliconix
Document Number: 71244
12-Jul-02
www.vishay.com
1
MSOP: 8−LEADS
JEDEC Part Number: MO-187, (Variation AA and BA)
N = 8L
MILLIMETERS
Dim Min Nom Max
Note
A
- - 1.10
A
1
0.05 0.10 0.15
A
2
0.75 0.85 0.95
b
0.25 - 0.38 8
b
1
0.25 0.30 0.33 8
c
0.13 - 0.23
c
1
0.13 0.15 0.18
D
3.00 BSC 3
E
4.90 BSC
E
1
2.90 3.00 3.10 3
e
0.65 BSC
e
1
1.95 BSC
L
0.40 0.55 0.70 4
N
8 5
T
0_ 4_ 6_
ECN: T-02080—Rev. C, 15-Jul-02
DWG: 5867

DG419LDY-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
Analog Switch ICs RECOMMENDED ALT 781-DG419LDY-T1
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union