STPS130U

STPS130
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Figure 11: Forward voltage drop versus
forward current (maximum values)
Figure 12: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB)
I (A)
FM
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0.01
0.10
1.00
10.00
V (V)
FM
T =25°C
j
T =75°C
j
T =125°C
j
012345
0
20
40
60
80
100
120
S(Cu)(cm²)
R (°C/W)
th(j-a)
P=1.5W
012345
0
20
40
60
80
100
120
140
S(Cu)(cm²)
R (°C/W)
th(j-a)
P=1.5W
STPS130
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Figure 14: SMA Package Mechanical Data
Figure 15: SMA Foot Print Dimensions
(in millimeters)
E
C
L
E1
D
A1
A2
b
2.40
1.65
1.45 1.45
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.03 0.075 0.080
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.41 0.006 0.016
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063
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Figure 16: SMB Package Mechanical Data
Figure 17: SMB Foot Print Dimensions
(in millimeters)
E
C
L
E1
D
A1
A2
b
1.52 2.75
2.3
1.52
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.41 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.60 0.030 0.063

STPS130U

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers 1.0 Amp 30 Volt
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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