AS7C34096A-10JIN

August 2004
Copyright © Alliance Semiconductor. All rights reserved.
AS7C34096A
3.3V 512K × 8 CMOS SRAM
®
8/17/04, v. 2.1 Alliance Semiconductor P. 1 of 9
Features
Pin compatible to AS7C34096
Industrial and commercial temperature
Organization: 524,288 words × 8 bits
Center power and ground pins
High speed
- 10/12/15/20 ns address access time
- 4/5/6/7 ns output enable access time
Low power consumption: ACTIVE
- 650 mW / max @ 10 ns
Low power consumption: STANDBY
- 28.8 mW / max CMOS
Equal access and cycle times
Easy memory expansion with
CE
,
OE
inputs
TTL-compatible, three-state I/O
JEDEC standard packages
- 400 mil 36-pin SOJ
- 44-pin TSOP 2
ESD protection 2000 volts
Latch-up current 200 mA
Logic block diagram
524,288 × 8
Array
(4,194,304)
Sense amp
Input buffer
I/O8
I/O1
OE
CE
WE
Column decoder
Row decoder
Control
Circuit
A0
A1
A2
A3
A4
A5
A6
A7
V
CC
GND
A8
A10
A11
A12
A13
A14
A15
A16
A17
A18
A9
Pin arrangements
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
A15
OE
I/O8
I/O7
GND
V
CC
I/O6
I/O5
A14
A13
A12
A11
A10
NC
A0
A1
A2
A3
A4
CE
I/O1
I/O2
V
CC
GND
I/O3
I/O4
WE
A5
A6
A7
17
18
A8
A9
36
35
34
33
NC
A18
A17
A16
GND
V
CC
I/O6
I/O5
NC
A14
A13
A12
A11
A10
A4
CE
I/O1
I/O2
V
CC
GND
I/O3
I/O4
WE
A5
A6
A7
A8
A9
I/O8
I/O7
A1
A2
A3
A0
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
43
42
41
44
A16
A15
A17
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
2
3
4
1
NC
NC
NC
NC
NC
NC
NC
NC
NC
OE
A18
36-pin SOJ (400 mil)
44-pin TSOP 2
Selection guide
–10 –12 –15 –20 Unit
Maximum address access time 10 12 15 20 ns
Maximum outputenable access time 4 5 6 7 ns
Maximum operating current
Industrial 180 160 140 110 mA
Commercial 170 150 130 100 mA
Maximum CMOS standby current 8 8 8 8 mA
®
AS7C34096A
8/17/04, v. 2.1 Alliance Semiconductor P. 2 of 9
Functional description
The AS7C34096A is a high-performance CMOS 4,194,304-bit Static Random Access Memory (SRAM) device organized as
524,288 words × 8 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are
desired.
Equal address access and cycle times (t
AA
, t
RC
, t
WC
) of 10/12/15/20 ns with output enable access times (t
OE
) of 4/5/6/7 ns are
ideal for high-performance applications. The chip enable input CE
permits easy memory expansion with multiple-bank memory
systems.
When CE
is high the device enters standby mode. The device is guaranteed not to exceed 28.8mW power consumption in
CMOS standby mode.
A write cycle is accomplished by asserting write enable (WE
) and chip enable (CE). Data on the input pins I/O1–I/O8 is written
on the rising edge of WE
(write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins
only after outputs have been disabled with output enable (OE
) or write enable (WE).
A read cycle is accomplished by asserting output enable (OE
) and chip enable (CE), with write enable (WE) high. The chip
drives I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or write
enable is active, output drivers stay in high-impedance mode.
All chip inputs and outputs are TTL-compatible, and operation is from a single 3.3V supply voltage. This device is available as
per industry standard 400-mil 36-pin SOJ and 44-pin TSOP 2 packages.
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and func-
tional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect reliability.
Key: X = Don’t care, L = Low, H = High
Absolute maximum ratings
Parameter Symbol Min Max Unit
Voltage on V
CC
relative to GND V
t1
–0.5 +5.0 V
Voltage on any pin relative to GND V
t2
–0.5 V
CC
+0.5 V
Power dissipation P
D
–1.0W
Storage temperature (plastic) T
stg
–65 +150 °C
Temperature with V
CC
applied T
bias
–55 +125 °C
DC current into output (low) I
OUT
–20mA
Truth table
CE WE OE Data Mode
H X X High Z
Standby (I
SB
, I
SB1
)
L H H High Z
Output disable (I
CC
)
LHL
D
OUT
Read (I
CC
)
LLX
D
IN
Write (I
CC
)
®
AS7C34096A
8/17/04, v. 2.1 Alliance Semiconductor P. 3 of 9
*
V
IL
min = –1.0V for pulse width less than 5ns.
**
V
IH
max = V
CC
+ 2.0V for pulse width less than 5ns.
Recommended operating condition
Parameter Symbol Min Nominal Max Unit
Supply voltage V
CC
(10/12/15/20) 3.0 3.3 3.6 V
Input voltage
V
IH
**
2.0 V
CC
+ 0.5 V
V
IL
*
–0.5 0.8 V
Ambient operating
temperature
commercial T
A
0– 70°C
industrial T
A
–40 85 °C
DC operating characteristics (over the operating range)
1
Parameter Symbol Test conditions
–10 –12 –15 –20
UnitMin Max Min Max Min Max Min Max
Input leakage
current
|I
LI
|
V
CC
= Max, V
IN
= GND to V
CC
–1–1–1–1µA
Output leakage
current
|I
LO
|
V
CC
= Max, CE = V
IH
V
OUT
= GND to V
CC
–1–1–1–1µA
Operating power
supply current
I
CC
V
CC
= Max, CE V
IL
f = f
Max
, I
OUT
= 0mA
Industrial
–180–160–140–110mA
Commercial
- 170 - 150 - 130 - 100 mA
Standby power
supply current
I
SB
V
CC
= Max, CE V
IH,
f = f
Max
–60–60–60–60mA
I
SB1
V
CC
= Max,
CE
V
CC
– 0.2V,
V
IN
0.2V or V
IN
V
CC
– 0.2V,
f = 0
–8–8–8–8mA
Output voltage
V
OL
I
OL
= 8 mA, V
CC
= Min
–0.4–0.4–0.4–0.4 V
V
OH
I
OH
= –4 mA, V
CC
= Min
2.4–2.4–2.4–2.4– V
Capacitance (f = 1MHz, T
a
= 25° C, V
CC
= NOMINAL)
2
Parameter Symbol Signals Test conditions Max Unit
Input capacitance C
IN
A, CE, WE, OE
V
IN
= 0V 5 pF
I/O capacitance C
I/O
I/O
V
IN
= V
OUT
= 0V 7 pF

AS7C34096A-10JIN

Mfr. #:
Manufacturer:
Alliance Memory
Description:
SRAM 4M, 3.3V, 10ns, FAST 512K x 8 Asynch SRAM
Lifecycle:
New from this manufacturer.
Delivery:
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