HBL1015T1G

© Semiconductor Components Industries, LLC, 2015
June, 2015 − Rev. 4
1 Publication Order Number:
HBL1015/D
HBL1015, HBL1025 Series
LED Shunt
The HBL1015/25 Series are electronic shunts which provide a
current bypass in the case of LEDs going into open circuit. LEDs are by
nature quite fragile when subjected to transients and surge conditions.
There are also many cases where high reliability of the LED lighting
must be maintained such as in headlights, lighthouses, bridges, aircraft,
runways and so forth. In these cases the low cost addition of the HBL
device will provide full assurance that an entire string of LEDs will not
extinguish should one LED fail open. The HBL device is also
applicable to other loads where circuit continuity is required. The
devices can be used with LED string currents from 140 to 500 mA.
Features
A Bidirectional Device
Automatically Resets Itself if the LED Heals Itself or is Replaced
ON−State Voltage Typically 1.8 V
OFF−State Current less than 0.5 mA
These are Pb−Free Devices
Typical Applications
LEDs where Preventive Maintenance is Impractical
LED Headlights
LEDs with High Reliability Requirements
Crowbar Protection for Open Circuit Conditions
Overvoltage Protection for Sensitive Circuits
Figure 1. Pin Connections
1. Device is bidirectional. Either configuration shown is acceptable.
2. Pin 2 must be electrically floating
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Control
Circuit
Anode
Cathode
MARKING DIAGRAM
1
5
xxx = Specific Device Code
(015 or 025)
M = Date Code
G = Pb−Free Package
TSOP−5
CASE 483
(Note: Microdot may be in either location)
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
1
5
xxx MG
G
HBL1015, HBL1025 Series
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
On−State Current, (T
A
= 25°C)
(Note 1)
(Note 2)
(Note 3)
I
T(AVG)
500
425
250
mA
Thermal Resistance, Junction−to−Air
(Note 1)
(Note 2)
(Note 3)
q
JA
140
150
255
°C/W
Operating Temperature Range T
J
−40 to 150 °C
Non−Operating Temperature Range T
J
150 °C
Lead Temperature, Soldering (10 Sec) T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted onto a 1500 mm
2
, Denka K1, 1.5 mm AI, 2 kV thermally conductive dielectric, 2 oz. Cu, or equivalent board. Heat sinking should
be spread equally among all pins (caution: pin 2 must be electrically isolated).
2. Mounted onto a 2−layer, 1000 mm
2
per layer, 3 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must
be electrically isolated).
3. Mounted onto a 2−layer, 50 mm
2
per layer, 1 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must
be electrically isolated).
NOTE: Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open,
then the HBL shunt would now dissipate the power using the same copper heat sink. Since the HBL has a voltage that is lower
than that of the LED(s), then the power dissipation would be easily handled by the same heat sink as the LED.
ELECTRICAL CHARACTERISTICS (Unless otherwise noted: T
A
= 25°C)
Symbol
Characteristics Min Min Typ Max Unit
V
(BR)
Breakdown Voltage: The minimum voltage across the device in or at
the breakdown region. Measured at I
BR
= 1 mA.
HBL1015 8.0
V
HBL1025 11.5
I
H
Holding Current: The minimum current required to maintain the de-
vice in the on-state.
HBL1015 125
mA
HBL1025 125
V
BO
Breakover Voltage: The voltage across the device in the breakover
region. Measured at I
BO
= 10 mA.
HBL1015 14.0
V
HBL1025 16.0
I
R
Off−State Current: The dc value of current that results from the ap-
plication of the off-state voltage. This is measured at 8.0 V for
HBL1015 and 11.5 V for HBL1025.
HBL1015 0.5 mA
HBL1025 0.5
V
T
On−State Voltage
HBL1015 1.2 1.8 2.4
V
HBL1025 1.2 1.8 2.4
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
HBL1015, HBL1025 Series
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3
TYPICAL PERFORMANCE CURVES
(T
A
= 25°C unless otherwise noted)
T
A
, AMBIENT TEMPERATURE (°C)
I
H
, HOLDING CURRENT (mA)
Figure 2. Holding Current vs Temperature
10
12
14
16
18
20
012345
VOLTS (V)
Figure 3. Capacitance vs Voltage
C
d
, CAPACITANCE (pF)
0
20
40
60
80
100
120
140
−50 −25 0 25 50 75 100 125 150
HBL1015
HBL1025
11
13
15
17
19
678
HBL1015
HBL1025
T
A
, AMBIENT TEMPERATURE (°C)
V
BR
, BREAKDOWN VOLTAGE (V)
Figure 4. Breakover Voltage vs Temperature
10
10.5
11
11.5
12
12.5
13
13.5
−50 −25 0 25 50 75 100 125 150
HBL1015
HBL1025
14
14.5
15
T
A
, AMBIENT TEMPERATURE (°C)
V
T
, ON−STATE VOLTAGE (V)
Figure 5. On−State Voltage vs Temperature
0
0.5
1.0
1.5
−50 −25 0 25 50 75 100 125 150
HBL1015/25 @ 350 mA
2.0
2.5
Figure 6. I−V Characteristics
Breakover
Voltage
Voltage
Current
On−state
Current
Holding Current
Latching Current
Off−state
Current
Breakdown
Voltage

HBL1015T1G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
LED Protection Devices TSPD GEN II 8-16V TSOP-5
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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