MAX4322/MAX4323/MAX4326/MAX4327/MAX4329
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
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UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform as well as a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user's assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP.
Performance through operating-life test and moisture
resistance remains uncompromised. The wafer-fabrica-
tion process primarily determines the performance.
Mechanical stress performance is a greater considera-
tion for UCSPs. UCSPs are attached through direct sol-
der contact to the user's PC board, foregoing the
inherent stress relief of a packaged product lead frame.
Solder-joint contact integrity must be considered.
Comprehensive reliability tests have been performed
and are available upon request. In conclusion, the
UCSP performs reliably through environmental stresses.
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. See the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.