MC74VHC157
http://onsemi.com
3
MAXIMUM RATINGS (Note 1)
Symbol Parameter Value Unit
V
CC
DC Supply Voltage *0.5 to )7.0 V
V
I
DC Input Voltage *0.5 to V
CC
)7.0 V
V
O
DC Output Voltage *0.5 to V
CC
)7.0 V
I
IK
DC Input Diode Current V
I
t GND *20 mA
I
OK
DC Output Diode Current V
O
t GND $20 mA
I
O
DC Output Sink Current $25 mA
I
CC
DC Supply Current per Supply Pin $100 mA
T
STG
Storage Temperature Range *65 to )150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260
_C
T
J
Junction Temperature under Bias )150
_C
q
JA
Thermal Resistance 250
_C/W
P
D
Power Dissipation in Still Air at 85_C
250 mW
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 30% − 35% UL−94−VO (0.125 in)
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
>2000
>200
N/A
V
I
Latch−Up
Latch−Up Performance Above V
CC
and Below GND at 85_C (Note 5)
$500 mA
1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum−rated
conditions is not implied.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
CC
DC Supply Voltage 2.0 5.5 V
V
IN
DC Input Voltage (Note 6) 0 5.5 V
V
OUT
DC Output Voltage 0 V
CC
V
T
A
Operating Temperature Range, all Package Types *55 125
_C
t
r
, t
f
Input Rise or Fall Time V
CC
= 3.3 V $ 0.3 V
V
CC
= 5.0 V $ 0.5 V
0
0
100
20
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature _C
Time, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 4. Failure Rate vs. Time Junction Temperature
NORMALIZED FAILURE RATE
TIME, YEARS
T
J
= 130_C
T
J
= 120_C
T
J
= 110_C
T
J
= 100_C
T
J
= 90_C
T
J
= 80_C