MC74VHC157DTR2G

MC74VHC157
Quad 2-Channel Multiplexer
The MC74VHC157 is an advanced highspeed CMOS quad
2channel multiplexer, fabricated with silicon gate CMOS
technology. It achieves highspeed operation similar to equivalent
BipolarSchottky TTL, while maintaining CMOS lowpower
dissipation.
It consists of four 2input digital multiplexers with common select
(S) and enable (E
) inputs. When E is held High, selection of data is
inhibited and all the outputs go Low.
The select decoding determines whether the A or B inputs get routed
to the corresponding Y outputs.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output. The
inputs tolerate voltages up to 7 V, allowing the interface of 5 V systems
to 3 V systems.
High Speed: t
PD
= 4.1 ns (Typ) at V
CC
= 5 V
Low Power Dissipation: I
CC
= 4 mA (Max) at T
A
= 25°C
High Noise Immunity: V
NIH
= V
NIL
= 28% V
CC
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Designed for 2 V to 5.5 V Operating Range
Low Noise: V
OLP
= 0.8 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance: HBM > 2000 V; Machine Model > 200 V
Chip Complexity: 82 FETs
These Devices are PbFree and are RoHS Compliant
Figure 1. Pin Assignment
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
S
Y0
B0
A0
Y1
B1
A1
GND
Y3
B3
A3
E
V
CC
B2
A2
Y2
© Semiconductor Components Industries, LLC, 2011
May, 2011 Rev. 6
1 Publication Order Number:
MC74VHC157/D
ORDERING INFORMATION
http://onsemi.com
Device Package Shipping
MC74VHC157DR2G SOIC16 2500 Units/Reel
SOIC16
D SUFFIX
CASE 751B
TSSOP16
DT SUFFIX
CASE 948F
MARKING
DIAGRAMS
MC74VHC157DTR2G TSSOP16 2500 Units/Reel
1
8
9
16
1
8
16 9
VHC157G
AWLYWW
VHC157 = Specific Device Code
A = Assembly Location
WL, L = Wafer Lot
Y = Year
WW, W = Work Week
G or G = PbFree Package
VHC
157
ALYW G
G
MC74VHC157
http://onsemi.com
2
Figure 2. Expanded Logic Diagram
4
7
9
12
2
3
5
6
11
10
14
13
15
1
A0
B0
A1
B1
A2
B2
A3
B3
Y0
Y1
Y2
Y3
E
S
DATA
OUTPUTS
NIBBLE
INPUTS
FUNCTION TABLE
E SY0 Y3
A0 A3, B0 B3 = the levels
of the respective DataWord
Inputs.
H
L
L
X
L
H
L
A0 A3
B0 B3
Inputs Outputs
3
E
S
A0
B0
A1
B1
A2
B2
2
5
6
11
10
14
13
12
9
7
4
Y0
MUX
Y1
Y2
Y3
EN
1
15
A3
B3
G1
1
1
Figure 3. IEC Logic Symbol
MC74VHC157
http://onsemi.com
3
MAXIMUM RATINGS (Note 1)
Symbol Parameter Value Unit
V
CC
DC Supply Voltage *0.5 to )7.0 V
V
I
DC Input Voltage *0.5 to V
CC
)7.0 V
V
O
DC Output Voltage *0.5 to V
CC
)7.0 V
I
IK
DC Input Diode Current V
I
t GND *20 mA
I
OK
DC Output Diode Current V
O
t GND $20 mA
I
O
DC Output Sink Current $25 mA
I
CC
DC Supply Current per Supply Pin $100 mA
T
STG
Storage Temperature Range *65 to )150
_C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260
_C
T
J
Junction Temperature under Bias )150
_C
q
JA
Thermal Resistance 250
_C/W
P
D
Power Dissipation in Still Air at 85_C
250 mW
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 30% 35% UL94VO (0.125 in)
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
>2000
>200
N/A
V
I
LatchUp
LatchUp Performance Above V
CC
and Below GND at 85_C (Note 5)
$500 mA
1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximumrated
conditions is not implied.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
V
CC
DC Supply Voltage 2.0 5.5 V
V
IN
DC Input Voltage (Note 6) 0 5.5 V
V
OUT
DC Output Voltage 0 V
CC
V
T
A
Operating Temperature Range, all Package Types *55 125
_C
t
r
, t
f
Input Rise or Fall Time V
CC
= 3.3 V $ 0.3 V
V
CC
= 5.0 V $ 0.5 V
0
0
100
20
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a highlogic voltage level or a lowlogic input voltage level.
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature _C
Time, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100
1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 4. Failure Rate vs. Time Junction Temperature
NORMALIZED FAILURE RATE
TIME, YEARS
T
J
= 130_C
T
J
= 120_C
T
J
= 110_C
T
J
= 100_C
T
J
= 90_C
T
J
= 80_C

MC74VHC157DTR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers 2-5.5V Quad 2-Channel
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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