AD8591/AD8592/AD8594
Rev. B | Page 16 of 16
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 47. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
AD8591ART-REEL −40°C to +85°C 6-Lead SOT-23 RJ-6 A9A
AD8591ART-REEL7 −40°C to +85°C 6-Lead SOT-23 RJ-6 A9A
AD8591ARTZ-REEL
1
−40°C to +85°C 6-Lead SOT-23 RJ-6 A9A#
AD8591ARTZ-REEL7
1
−40°C to +85°C 6-Lead SOT-23 RJ-6 A9A#
AD8592ARM-REEL −40°C to +85°C 10-Lead MSOP RM-10 AQA
AD8592ARMZ-REEL
1
−40°C to +85°C 10-Lead MSOP RM-10 AQA#
AD8594AR −40°C to +85°C 16-Lead SOIC_N R-16
AD8594AR-REEL −40°C to +85°C 16-Lead SOIC_N R-16
AD8594AR-REEL7 −40°C to +85°C 16-Lead SOIC_N R-16
AD8594ARZ
1
−40°C to +85°C 16-Lead SOIC_N R-16
AD8594ARZ-REEL
1
−40°C to +85°C 16-Lead SOIC_N R-16
AD8594ARZ-REEL7
1
−40°C to +85°C 16-Lead SOIC_N R-16
AD8594ARU-REEL −40°C to +85°C 16-Lead TSSOP RU-16
AD8594ARUZ-REEL
1
−40°C to +85°C 16-Lead TSSOP RU-16
1
Z = RoHS Compliant Part, # denotes RoHS compliant part may be top or bottom marked.
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registered trademarks are the property of their respective owners.
D01106-0-1/09(B)
