MAX14676D
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V. Quality Assurance Information
A. Quality Assurance Contacts: Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% for all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (
) is calculated as follows:
= 1 =
1.83 (Chi square value for MTTF upper limit)
MTTF
192 x 4340 x 48 x 2
= 22.9 x 10
-9
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim Integrated's reliability monitor program. Maxim Integrated
performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at
http://www.maximintegrated.com/qa/reliability/monitor. Cumulative monitor data for the S18 Process results in a FIT Rate of 0.05 @
25°C and 0.93 @ 55°C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing
The AL69-2 die type has been found to have all pins able to withstand an HBM transient pulse of +/-1000V per
JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250mA and overvoltage
per JEDEC JESD78.
