date 05/08/2017
page
1 of 5
cui.com
SERIES: HSE-BX-04H-01 │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 package
• placement pins for secure PCB attachment
• round hole for component attachment
• multiple available cut lengths
MODEL
thermal resistance
1
power
dissipation
1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B250-04H 25 9.38 13.60 3.26 2.25 8.00
HSE-B500-04H 50 6.15 8.05 2.88 2.12 12.20
HSE-B630-04H 63 5.21 9.37 2.31 1.86 14.40
Note: 1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
01 2345
6789
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 13.60 3.26 2.25
2 24.62 6.61 4.65
3 34.26 10.05 7.18
4 43.45 13.46 9.67
5 51.69 16.85 12.11
6 60.18 20.16 14.49
7 68.13 23.72 17.06
8 75.33 27.06 19.37
9 82.77 30.36 21.85
10 90.41 34.06 24.45
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B250-04H
For more information, please visit the product page.
