MSD1328−RT1, MSD1328−ST1
http://onsemi.com
2
PACKAGE DIMENSIONS
S
G
H
D
C
B
L
A
1
3
2
J
K
DIM
A
MIN MAX MIN MAX
INCHES
2.70 3.10 0.1063 0.1220
MILLIMETERS
B 1.30 1.70 0.0512 0.0669
C 1.00 1.30 0.0394 0.0511
D 0.35 0.50 0.0138 0.0196
G 1.70 2.10 0.0670 0.0826
H 0.013 0.100 0.0005 0.0040
J 0.09 0.18 0.0034 0.0070
K 0.20 0.60 0.0079 0.0236
L 1.25 1.65 0.0493 0.0649
S 2.50 3.00 0.0985 0.1181
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
2.4
0.094
0.95
0.037
0.95
0.037
1.0
0.039
0.8
0.031
mm
inches
SCALE 10:1
SC−59
CASE 318D−04
ISSUE F
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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MSD1328−RT1/D
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