Tflex
TM
HD700 Series
Thermal Gap Filler
Americas: +1.866.928.8181
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
PRODUCT DESCRIPTION
Laird Tflex™ HD700 Is our latest product in our High Deflection series. Tflex™ HD700 combines 5
W/mK thermal conductivity with superior pressure versus deflection characteristics. The
combination will allow minimal stress on components while also yielding low thermal resistance.
As a result, less mechanical and thermal stresses will be experienced within your device.
Tflex™ HD700 is available in thickness from 0.5mm (0.020”) to 5mm (0.200”). Laird can provide
material to meet your production needs in any region through our local production facilities.
Please contact your local Laird sales or field engineering contact for samples or questions.
FEATURES AND BENEFITS
• 5.0 W/mK thermal conductivity
• Low pressure versus deflection
• Excellent surface wetting for low contact resistance
• Minimizes board and component stress
• Large tolerance applications
• Environmentally friendly solution that meets regulatory requirements including RoHS and
REACH
SPECIFICATIONS
TYPICAL PROPERTIES VALUE TEST METHOD
Construction & Composition Ceramic filled silicone sheet N/A
Color Pink Visual
Thickness Range 0.50mm (0.020”) 5.0mm (0.20”) N/A
Thermal Conductivity (W/mK) 5.0 ASTM D5470
Density (g/cc) 3.3 Helium Pycnometer
Hardness (Shore 00) 66 (0.5-0.75mm)
55 (1-5mm)
ASTM D2240
Outgassing TML (weight %) 0.23 ASTM E595
Outgassing CVCM (weight %) 0.07 ASTM E595
Temperature Range -50°C to 200°C Laird Test Method
Rth@ 40 mils, 10 psi 0.287°C–in2/W ASTM D5470 (Modified)
Dielectric Constant @ 1 MHz 5.01 ASTM D150
UL Flammability Rating V-0 UL 94
Volume Resistivity 1.4x 10
14
ohm-cm ASTM D257