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L5300RPTTR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25
Package and PCB thermal data L5300RPT
16/25 Doc ID 15479 Rev 9
4 Package and PCB thermal data
Figure 22. PPAK PC board
Figure 23. R
thj-amb
vs PCB copper area in open box free air condition
*$3*&)7
Note:
Layout condition of R
th
and Z
th
measurements (Board finish thickness 1.6 mm +/- 10%; Board double layer; Board dimension
78 x 86; Board Material FR4; Cu thickness 0.070 mm (front and back side); Thermal vias separation 1.2 mm; Thermal via
diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm
30
40
50
60
70
80
90
0246810
RTHjamb
RTHjamb
GAPGCFT00131
L5300RPT Package and PCB thermal data
Doc ID 15479 Rev 9 17/25
Figure 24. PPAK thermal impedance junction ambient single pulse
Equation 3: pulse calculation formula
where δ = t
P
/T
Figure 25. Thermal fitting model of a Vreg in PPAK
1
10
100
0.01 0.1 1 10 100 1000
ZTH (°C/W)
Time (s)
Cu=8 cm2
Cu=2 cm2
Cu=foot print
GAPGCFT00132
Z
THδ
R
TH
δ Z
THtp
1 δ–()+
⋅
=
GAPGCFT 00133
Package and PCB thermal data L5300RPT
18/25 Doc ID 15479 Rev 9
Table 7. PPAK thermal parameter
Area (cm
2
)Footprint48
R1 (°C/W) 1.2
R2 (°C/W) 1.8
R3 (°C/W) 2.5
R4 (°C/W) 14 12 12
R5 (°C/W) 28 22 12
R6 (°C/W) 36 27 16
C1 (W.s/°C) 0.001
C2 (W.s/°C) 0.005
C3 (W.s/°C) 0.01
C4 (W.s/°C) 0.6 0.6 0.6
C5 (W.s/°C) 0.8 2 4
C6 (W.s/°C) 3 5 9
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25

L5300RPTTR

Mfr. #:
Buy L5300RPTTR
Manufacturer:
STMicroelectronics
Description:
LDO Voltage Regulators 5V LDVR w/MPU 60uA 10uA 300mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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