LTC3202EMS#TRPBF

10
LTC3202
3202fa
Figure 6. Recommended Layouts
V
OUT
GND
V
IN
Layout Considerations
Due to its high switching frequency and the transient
currents produced by the LTC3202, careful board layout is
necessary. A true ground plane and short connections to
all capacitors will improve performance and ensure proper
regulation under all conditions. Figure 6 shows the recom-
mended layout configurations.
The flying capacitor pins C1
+
, C2
+
, C1
and C2
will have
very high edge rate waveforms. The large dv/dt on these
pins can couple energy capacitively to adjacent printed
circuit board runs. Magnetic fields can also be generated
if the flying capacitors are not close to the LTC3202 (i.e.
the loop area is large). To decouple capacitive energy
transfer, a Faraday shield may be used. This is a grounded
PC trace between the sensitive node and the LTC3202
pins. For a high quality AC ground it should be returned to
a solid ground plane that extends all the way to the
LTC3202.
OPERATIO
U
Figure 7. Alternative Brightness Control
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the LTC3202.
If the junction temperature increases above approxi-
mately 160°C the thermal shutdown circuitry will auto-
matically deactivate the output. To reduce the maximum
junction temperature, a good thermal connection to the
PC board is recommended. Connecting the GND pin (Pin
5 and Pin 11 on the DFN package) to a ground plane, and
maintaining a solid ground plane under the device can
reduce the thermal resistance of the package and PC
board considerably.
Brightness Control Using Pulse Width Modulation
An alternative approach to dimming is to use pulse width
modulation rather than the internal digital to analog con-
verter. By connecting both the D0 and D1 pins to a PWM
signal, continuous brightness control can be achieved.
Frequencies from 100Hz to 500Hz are acceptable with a
1µF to 4.7µF output capacitor.
V
D0, D1
t
10
1
D0
D1
LTC3202
3202 F07
V
OUT
V
IN
GND
3202 F06
D1 D0
11
LTC3202
3202fa
PACKAGE DESCRIPTIO
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
0.200 REF
0.00 – 0.05
(DD10) DFN 0103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.25 ±0.05
0.50
BSC
0.55 ±0.05
3.35 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
MSOP (MS) 0603
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
12
3
45
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
7
6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
12
LTC3202
3202fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
LINEAR TECHNOLOGY CORPORATION 2001
LT/TP 0803 1K • PRINTED IN USA
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3202 TA02
LTC3202
V
OUT
FB
GND
C4
1µF
C1
1µF
5, 11
3
2
C2
C2
+
C1
C1
+
V
IN
3V TO 4.5V
10
4
1
36 36 36 36 36 36
C3
1µF
C2
1µF
D0
D1
V
IN
8
7
96
ON
OFF
R2
3.9k
R1
1k
V
C
= 0V TO 3V
I
LED
=
(
1 +
)
0.6V
36
R1
R2
V
C
36
R1
R2
–•
U
TYPICAL APPLICATIO
LED Driver with Linear Brightness Control

LTC3202EMS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 120mA Inductorless LED Driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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