2
Electrical Specications
1. Small/Large -signal data measured in a fully de-embedded test xture form TA = 25°C, Vd=5V, Idq=107mA.
2. Pre-assembly into package performance veried 100% on-wafer per AMMC-5618 published specications
3. This nal package part performance is veried by a functional test correlated to actual performance at one or
more frequencies
4. Specications are derived from measurements in a 50Ω test environment. Aspects of the amplier performance
may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise
(Γopt) matching.
Table 1. RF Electrical Characteristics (T
A
= 25°C, V
d
= 5.0V, I
dq
=107 mA, Zo=50 Ω)
Parameter Typ. Sigma Unit Frequency
Small-signal Gain, Gain 12
13
0.40 dB 5-6 GHz
Noise Figure into 50 Ω, NF 4.4 0.2 dB
Output Power at 1dB Gain Compression, P1dB 19 0.9 dBm
Third Order Intercept Point;
∆f=100MHz; Pin=-20dBm, OIP3
25
30
1.2 dBm 5-6 GHz
Input Return Loss, RLin -12 0.7 dB
Output Return Loss, Rlout -12 0.6 dB
Reverse Isolation, Isolation -40 1.2 dB
Table 2. Recommended Operating Range
1. Ambient operational temperature T
A
= 25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal
Resistance at backside temperature (Tb)= 25°C calculated from measured data.
Description
Specications
Unit CommentsMin. Typical Max.
Drain Supply Current, Id 107 140 mA (Vd = 5 V, Under any RF power
drive and temperature
Table 3. Thermal Properties
Parameter Test Conditions Value
Thermal Resistance, q
ch-b
Backside Temperature, T
A
=25°C
q
ch-b
= 34 °C/W
Absolute Minimum and Maximum Ratings
Table 4. Minimum and Maximum Ratings
Description
Specications
Unit CommentsMin. Max.
Positive Drain Voltage, Vd 7 V
Drain Current, Id 150 mA
RF Input Power (Pin), RFin 20 dBm CW
Channel Temperature, Tch +150 °C
Storage Temperature, Tstg -65 +150 °C
Max. Assembly Temp, Tmax +300 °C 30 second maximum
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.