0402ESDA-MLP1
Recommended
for
New Designs
Electrical Characteristics
Characteristic Value
Rated Voltage 30VDC maximum
Clamping Voltage
1
35V typical
Trigger Voltage
2
300V typical
Capacitance (@1MHz) 0.05pF typ., 0.15pF max.
Attenuation Change (0-6GHz) -0.2dB typical
Leakage Current (@12VDC) <0.1nA typical
ESD Capability
IEC61000-4-2 Direct Discharge 8kV typical
IEC61000-4-2 Air Discharge 15kV typical
ESD Pulse Withstand
1
>1000 typical
Notes:
1. Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A)
measured 30ns after initiation of pulse.
2. Trigger measurement made using Transmission Line Pulse
(TLP) method.
3. Minor shifting in characteristics may be observed over
multiple ESD pulses at very rapid rate.
Environmental Specifications:
• Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85% RH for 1000 hours
• Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +125°C, 5 cycles
• Moisture Resistance Test: MIL-STD-202G Method 106G, 10 cycles
• Mechanical Shock: EIA/IS-722 Para. 4.9
• Vibration: EIA/IS-722 Para. 4.10
• Resistance to Solvent: EIA/IS-722 Para. 4.11
• Operating & Storage Temperature Range: -55°C to +125°C
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
• IR Reflow = 260°C max for 10 sec. max.
• Wave Solder = 260°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
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Technologies
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Cooper Electronic
Technologies
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737
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786
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0402-MLP 3/07
© Cooper Electronic
Technologies 2007
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