SiHP16N50C, SiHB16N50C, SiHF16N50C
www.vishay.com
Vishay Siliconix
S11-1116-Rev. B, 13-Jun-11
2
Document Number: 91401
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Note
• The information shown here is a preliminary product proposal, not a commercial product data sheet. Vishay Siliconix is not committed to
produce this or any similar product. This information should not be used for design purposes, nor construed as an offer to furnish or sell
such products.
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TO220-AB D
2
PAK (TO-263) TO-220 FULLPAK UNIT
Maximum Junction-to-Ambient R
thJA
62 65
°C/WMaximum Junction-to-Case (Drain) R
thJC
0.5 3.3
Junction-to-Ambient (PCB mount)
a
R
thJA
40 -
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 500 - - V
V
DS
Temperature Coefficient V
DS
/T
J
Reference to 25 °C, I
D
= 1 mA - 0.6 - V/°C
Gate-Source Threshold Voltage (N) V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 3.0 - 5.0 V
Gate-Source Leakage I
GSS
V
GS
= ± 30 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 500 V, V
GS
= 0 V - - 50
μA
V
DS
= 400 V, V
GS
= 0 V, T
J
= 125 °C - - 250
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 8 A - 0.31 0.38
Forward Transconductance
a
g
fs
V
DS
= 50 V, I
D
= 3 A - 3 - S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz
- 1900 -
pFOutput Capacitance C
oss
- 230 -
Reverse Transfer Capacitance C
rss
-24-
Total Gate Charge Q
g
V
GS
= 10 V I
D
= 16 A, V
DS
= 400 V
-4568
nC
Gate-Source Charge Q
gs
-18-
Gate-Drain Charge Q
gd
-22-
Turn-On Delay Time t
d(on)
V
DD
= 250 V, I
D
= 16 A,
R
g
= 9.1
V
GS
= 10 V
-27-
ns
Rise Time t
r
- 156 -
Turn-Off Delay Time t
d(off)
-29-
Fall Time t
f
-31-
Gate Input Resistance R
g
f = 1 MHz, open drain - 1.6 -
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--16
A
Pulsed Diode Forward Current I
SM
--30
Body Diode Voltage V
SD
T
J
= 25 °C, I
S
= 10 A, V
GS
= 0 V - - 1.8 V
Body Diode Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= I
S
, dI/dt = 100 A/μs,
V
R
= 20 V
- 555 - ns
Body Diode Reverse Recovery Charge Q
rr
-5.5-μC
Body Diode Reverse Recovery Current I
RRM
-18- A