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MMA6261QR2

P1-P3P4-P6P7-P9P10-P11
MMA6260Q
Sensors
Freescale Semiconductor 7
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
13
8
16
5
0.50
6.0
Solder areas
Pin 1 ID (non metallic)
9
12
4.25
6.0
14
1.00
0.55
Flag
Non-Solder areas
MMA6260Q
Sensors
8 Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1477-02
ISSUE B
16-LEAD QFN
PAGE 1 OF 3
MMA6260Q
Sensors
Freescale Semiconductor 9
PACKAGE DIMENSIONS
CASE 1477-02
ISSUE B
16-LEAD QFN
PAGE 2 OF 3
P1-P3P4-P6P7-P9P10-P11

MMA6261QR2

Mfr. #:
Buy MMA6261QR2
Manufacturer:
NXP / Freescale
Description:
Accelerometers 1.5 XY LDS 6X6
Lifecycle:
New from this manufacturer.
Delivery:
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