OP281/OP481
Rev. D | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
Supply Voltage 16 V
Input Voltage GND to V
S
+ 10 V
Differential Input Voltage ±3.5 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Junction Temperature Range −65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 5. Thermal Resistance
Package Type θ
JA
1
θ
JC
Unit
8-Lead SOIC (R Suffix) 158 43 °C/W
8-Lead TSSOP (RU Suffix) 240 43 °C/W
14-Lead SOIC (R Suffix) 120 36 °C/W
14-Lead TSSOP (RU Suffix) 240 43 °C/W
1
θ
JA
is specified for the worst-case conditions, that is, θ
JA
is specified for device
soldered in circuit board for TSSOP and SOIC packages.
ESD CAUTION