Eaton
Electronics Division
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United States
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Printed in USA
Publication No. 10448 BU-MC15030
October 2015
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FP1108L1 and FP1108L2
High frequency, high current power inductors
Technical Data 10448
Effective October 2015
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
t
P
t
s
T
C
-5°C
Time 25°C to Peak
Time
°C
T
smin
T
smax
T
L
T
P
Preheat
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (T
smin
) 100°C 150°C
• Temperature max. (T
smax
) 150°C 200°C
• Time (T
smin
to T
smax
) (t
s
) 60-120 Seconds 60-120 Seconds
Average ramp up rate T
smax
to T
p
3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (t
L
)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (T
P
)* Table 1 Table 2
Time (t
p
)** within 5 °C of the specified classification temperature (T
c
) 20 Seconds** 30 Seconds**
Average ramp-down rate (T
p
to T
smax
) 6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (T
c
)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (T
c
)
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
