Applications information TDA7293
10/21 Doc ID 6744 Rev 8
4 Applications information
4.1 Applications suggestions
The recommended values of the external components are those shown on the application
circuit of Figure 1 on page 1. Different values can, however, be used and the following table
could be useful when choosing alternative values.
Figure 7. Slave function: pin 4 (Ref to pin 8)
Table 5. Choosing alternative component values
Component
Suggested
value
Purpose
Larger than
suggested
Smaller than
suggested
R1
(1)
1. R1 = R3 for pop optimization
22 k Input resistance
Increase input
impedance
Decrease input
impedance
R2 680
Closed loop gain,
set to 30 dB
(2)
2. Closed loop gain has to be ³ 26dB
Decrease of gain Increase of gain
R3
(1)
22 k Increase of gain Decrease of gain
R4 22 k Standby time constant
Larger Standby
on/off time
Smaller standby
ON/OFF time; pop
noise
R5 10 k Mute time constant
Larger mute
on/off time
Smaller mute
on/off time
C1 0.47 µF Input DC decoupling -
Higher low-frequency
cutoff
C2 22 µF
Feedback DC
decoupling
-
Higher low-frequency
cutoff
C3 10 µF Mute time constant
Larger mute
on/off time
Smaller mute on/off
time
C4 10 µF Standby time constant
Larger standby
on/off time
Smaller standby on/off
time; pop noise
C5 22 µF
(3)
x N
3. Multiply this value by the number, N, of modular parts connected
Bootstrapping -
Signal degradation at
low frequency
C6, C8 1000 µF Supply voltage bypass - -
C7, C9 0.1 µF Supply voltage bypass - Danger of oscillation
MASTER
UNDEFINED
SLAVE
-V
S
+3V
-V
S
+1V
-V
S
D98AU821
Note: If in the application the speakers are
connected via long wires, it is a good rule
to add, between the output and GND, a
boucherot cell in order to avoid dangerous
spurious oscillations if the speakers
terminal are shorted.
The suggested boucherot resistor is
3.9
/2W and the capacitor is 1
µ
F.
TDA7293 Applications information
Doc ID 6744 Rev 8 11/21
4.2 High efficiency
Constraints of implementing high power solutions are the power dissipation and the size of
the power supply. These are both due to the low efficiency of conventional AB class
amplifier approaches.
The circuit below in Figure 8 is a high efficiency amplifier which can be adopted for both hi-fi
and car-radio applications. The TDA7293 is a monolithic MOS power amplifier which can be
operated with a 100-V supply (120 V with no signal applied) while delivering output currents
up to ±6.5 A. This allows the use of this device as a very high-power amplifier (up to 180 W
peak power with THD = 10% and R
L
= 4 ); the only drawback is the power dissipation,
hardly manageable in the above power range.
The typical junction-to-case thermal resistance of the TDA7293 is 1 °C/W (max = 1.5 °C/W).
In worst case conditions, to avoid the chip temperature exceeding 150 °C the thermal
resistance of the heatsink must be 0.038 °C/W (at a maximum ambient temperature of
50 °C).
As the above value is pratically unreachable, a high efficiency system is needed in those
cases where the continuous average output power is higher than 50 to 60 W.
The TDA7293 was designed to work also in a higher efficiency way. For this reason there
are four power supply pins: two intended for the signal part and two for the power part. T1
and T2 are two power transistors that only operate when the output power reaches a certain
threshold (for example, 20 W).
If the output power increases, these transistors are switched on during the portion of the
signal where more output voltage swing is needed, thus "bootstrapping" the power supply
pins (13 and 15). The current generators formed by T4, T7, zener diodes Z1, Z2 and
resistors R7, R8 define the minimum drop across the power MOS transistors of the
TDA7293. L1, L2, L3 and the snubbers C9, R1 and C10, R2 stabilize the loops formed by
the "bootstrap" circuits and the output stage of the TDA7293.
By considering again a maximum average output power (music signal) of 20 W, in case of
the high efficiency application, the thermal resistance value needed from the heatsink is
2.2 °C/W (with V
S
= ±50 V and R
L
= 8 ). All components (TDA7293 and power transistors
T1 and T2) can be placed on a 1.5 °C/W heatsink, with the power darlingtons electrically
insulated from the heatsink.
Since the total power dissipation is less than that of a usual class AB amplifier, additional
cost savings can be obtained while optimizing the power supply, even with a large heatsink.
4.3 Bridge application
Another application suggestion is the bridge configuration, where two TDA7293 are used.
In this application, the value of the load must not be lower than 8 for dissipation and
current capability reasons.
A suitable field of application includes hi-fi/TV subwoofer realizations. The main advantages
offered by this solution are:
z High power performance with limited supply voltage level.
z Considerably higher output power even with high load values, such as 16 .
With R
L
= 8 and V
S
= ±25 V, the maximum output power obtainable is 150 W, whilst with
R
L
= 16 and V
S
= ±40 V, the maximum Pout is 200 W.
Applications information TDA7293
12/21 Doc ID 6744 Rev 8
4.4 Modular application (ref. figure 12)
The modular application is where several devices operate in parallel.
The modular application allows very high power be delivered to very low-impedance loads.
In this type of application one device acts as a master and the others as slaves.
The slave power stages are driven by the master device and work in parallel together while
the input and the gain stages of the slave devices are disabled. The figure below shows the
connections required to configure two devices to work together.
z The master chip connections are the same as the normal single ones.
z The outputs can be connected together without the need of any ballast resistor.
z The slave SGND pin must be tied to the negative supply.
z The slave STANDBY and MUTE pins must be connected to the master STANDBY and
MUTE pins.
z The bootstrap lines must be connected together and the bootstrap capacitor must be
increased: for N devices the bootstrap capacitor must be 22 µF times N.
z The slave IN pin must be connected to the negative supply.
4.5 Bootstrap capacitor
For compatibility purpose with the previous devices of the family, the bootstrap capacitor can
be connected either between the bootstrap pin (6) and the output pin (14) or between the
bootstrap pin (6) and the bootstrap loader pin (12).
When the bootstrap is connected between pins 6 and 14 the maximum supply voltage in the
presence of an output signal is limited to 100 V, due the bootstrap capacitor overvoltage.
When the bootstrap is connected between pins 6 and 12 the maximum supply voltage
extends to the full voltage that the technology can stand, in this case 120 V.
This is accomplished by the clamp introduced at the bootstrap loader pin (12). This pin
follows the output voltage up to 100 V and remains clamped at 100 V for higher output
voltages.
This feature lets the output voltage swing up to a gate-source voltage from the positive
supply (V
S
-3 to 6 V).

TDA7293HS

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Audio Amplifiers 100W Audio Amplifier
Lifecycle:
New from this manufacturer.
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