Philips Semiconductors Product specification
SCC2692Dual asynchronous receiver/transmitter (DUART)
1998 Sep 04
4
BLOCK DIAGRAM
8
D0–D7
RDN
WRN
CEN
A0–A3
RESET
INTRN
X1/CLK
X2
4
BUS BUFFER
OPERATION CONTROL
ADDRESS
DECODE
R/W CONTROL
INTERRUPT CONTROL
IMR
ISR
TIMING
BAUD RATE
GENERATOR
CLOCK
SELECTORS
COUNTER/
TIMER
XTAL OSC
CSRA
CSRB
ACR
CTLR
CHANNEL A
TRANSMIT
HOLDING REG
TRANSMIT
SHIFT REGISTER
RECEIVE
HOLDING REG (3)
RECEIVE
SHIFT REGISTER
MRA1, 2
CRA
SRA
INPUT PORT
CHANGE OF
STATE
DETECTORS (4)
OUTPUT PORT
FUNCTION
SELECT LOGIC
OPCR
TxDA
RxDA
IP0-IP6
OP0-OP7
V
CC
GND
CONTROL
TIMING
INTERNAL DATABUS
CHANNEL B
(AS ABOVE)
IPCR
ACR
OPR
CTLR
U
RxDB
TxDB
8
7
SD00132
Figure 2. Block Diagram
Philips Semiconductors Product specification
SCC2692Dual asynchronous receiver/transmitter (DUART)
1998 Sep 04
5
PIN DESCRIPTION
SYMBOL
APPLICABLE
TYPE
NAME AND FUNCTION
SYMBOL
40,44 28
TYPE
NAME
AND
FUNCTION
D0-D7 X X I/O Data Bus: Bidirectional 3-State data bus used to transfer commands, data and status between the
DUART and the CPU. D0 is the least significant bit.
CEN X X I Chip Enable: Active-Low input signal. When Low, data transfers between the CPU and the DUART
are enabled on D0-D7 as controlled by the WRN, RDN and A0-A3 inputs. When High, places the
D0-D7 lines in the 3-State condition.
WRN X X I Write Strobe: When Low and CEN is also Low, the contents of the data bus are loaded into the
addressed register. The transfer occurs on the rising edge of the signal.
RDN X X I Read Strobe: When Low and CEN is also Low, causes the contents of the addressed register to be
presented on the data bus. The read cycle begins on the falling edge of RDN.
A0-A3 X X I Address Inputs: Select the DUART internal registers and ports for read/write operations.
RESET X X I Reset: A High level clears internal registers (SRA, SRB, IMR, ISR, OPR, OPCR), puts OP0-OP7 in
the High state, stops the counter/timer, and puts Channels A and B in the inactive state, with the TxDA
and TxDB outputs in the mark (High) state. Resets Test modes, MR pointer set to MR1.
INTRN X X O Interrupt Request: Active-Low, open-drain, output which signals the CPU that one or more of the
eight maskable interrupting conditions are true.
X1/CLK X X I Crystal 1: Crystal connection or an external clock input. A crystal of a clock the appropriate frequency
(nominally 3.6864 MHz) must be supplied at all times. For crystal connections see Figure 7, Clock Timing.
X2 X X I Crystal 2: Crystal connection. See Figure 7. If a crystal is not used it is best to keep this pin not
connected although it is permissible to ground it.
RxDA X X I Channel A Receiver Serial Data Input: The least significant bit is received first. “Mark” is High,
“space” is Low.
RxDB X X I Channel B Receiver Serial Data Input: The least significant bit is received first. “Mark” is High,
“space” is Low.
TxDA X X O Channel A Transmitter Serial Data Output: The least significant bit is transmitted first. This output is
held in the “mark” condition when the transmitter is disabled, idle or when operating in local loopback
mode. “Mark” is High, “space” is Low.
TxDB X X O Channel B Transmitter Serial Data Output: The least significant bit is transmitted first. This output
is held in the ‘mark’ condition when the transmitter is disabled, idle, or when operating in local
loopback mode. ‘Mark’ is High, ‘space’ is Low.
OP0 X X O Output 0: General purpose output or Channel A request to send (RTSAN, active-Low). Can be
deactivated automatically on receive or transmit.
OP1 X X O Output 1: General purpose output or Channel B request to send (RTSBN, active-Low). Can be
deactivated automatically on receive or transmit.
OP2 X O Output 2: General purpose output, or Channel A transmitter 1X or 16X clock output, or Channel A
receiver 1X clock output.
OP3 X O Output 3: General purpose output or open-drain, active-Low counter/timer output or Channel B
transmitter 1X clock output, or Channel B receiver 1X clock output.
OP4 X O Output 4: General purpose output or Channel A open-drain, active-Low, RxRDYAN/FFULLAN output.
OP5 X O Output 5: General purpose output or Channel B open-drain, active-Low, RxRDYBN/FFULLBN output.
OP6 X O Output 6: General purpose output or Channel A open-drain, active-Low, TxRDYAN output.
OP7 X O Output 7: General purpose output, or Channel B open-drain, active-Low, TxRDYBN output.
IP0 X I Input 0: General purpose input or Channel A clear to send active-Low input (CTSAN). Pin has an
internal V
CC
pull-up device supplying 1 to 4 A of current.
IP1 X I Input 1: General purpose input or Channel B clear to send active-Low input (CTSBN). Pin has an
internal V
CC
pull-up device supplying 1 to 4 A of current.
IP2 X X I Input 2: General purpose input or counter/timer external clock input. Pin has an internal V
CC
pull-up
device supplying 1 to 4 A of current.
IP3 X I Input 3: General purpose input or Channel A transmitter external clock input (TxCA). When the
external clock is used by the transmitter, the transmitted data is clocked on the falling edge of the
clock. Pin has an internal V
CC
pull-up device supplying 1 to 4 A of current.
IP4 X I Input 4: General purpose input or Channel A receiver external clock input (RxCA). When the external
clock is used by the receiver, the received data is sampled on the rising edge of the clock. Pin has an
internal V
CC
pull-up device supplying 1 to 4 A of current.
IP5 X I Input 5: General purpose input or Channel B transmitter external clock input (TxCB). When the
external clock is used by the transmitter, the transmitted data is clocked on the falling edge of the
clock. Pin has an internal V
CC
pull-up device supplying 1 to 4 A of current.
IP6 X I Input 6: General purpose input or Channel B receiver external clock input (RxCB). When the external
clock is used by the receiver, the received data is sampled on the rising edge of the clock. Pin has an
internal V
CC
pull-up device supplying 1 to 4 A of current.
V
CC
X X I Power Supply: +5V supply input.
GND X X I Ground
Philips Semiconductors Product specification
SCC2692Dual asynchronous receiver/transmitter (DUART)
1998 Sep 04
6
DC ELECTRICAL CHARACTERISTICS
1,
2,
3
SYM-
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
BOL
PARAMETER
TEST
CONDITIONS
Min Typ Max
UNIT
V
IL
Input low voltage 0.8 V
V
IH
Input high voltage (except X1/CLK)
6
2.0 V
V
IH
Input high voltage (except X1/CLK)
7
2.5 V
V
IH
Input high voltage (X1/CLK) 0.8 V
CC
V
V
OL
Output low voltage
I
OL
= 2.4mA
0.4 V
V
OH
Output high voltage (except OD outputs)
4
I
OH
= -400µA
V
CC
-0.5 V
I
IX1PD
X1/CLK input current - power down
V
IN
= 0 to V
CC
-10 +10 µA
I
ILX1
X1/CLK input low current - operating V
IN
= 0 -75 0 µA
I
IHX1
X1/CLK input high current - operating V
IN
= V
CC
0 75 µA
I
OHX2
X2 output high current - operating
V
OUT
= V
CC
, X1 = 0
0 +75 µA
I
OHX2S
X2 output high short circuit current - operating V
OUT
= 0, X1 = 0 -10 -1 mA
I
OLX2
X2 output low current - operating V
OUT
= 0, X1 = V
CC
-75 0 µA
I
OLX2S
X2 output low short circuit current - operating and power down V
OUT
= V
CC
, X1 = V
CC
1 10 mA
Input leakage current:
I
I
All except input port pins V
IN
= 0 to V
CC
-10 +10 µA
Input port pins V
IN
= 0 to V
CC
-20 +10 µA
I
OZH
Output off current high, 3-state data bus V
IN
= V
CC
10 µA
I
OZL
Output off current low, 3-state data bus V
IN
= 0V -10 µA
I
ODL
Open-drain output low current in off-state V
IN
= 0 -10 µA
I
ODH
Open-drain output high current in off-state V
IN
= V
CC
10 µA
Power supply current
5
I
CC
Operating mode CMOS input levels 10 mA
Power down mode
8
CMOS input levels
2
10
A
NOTES:
1. Parameters are valid over specified temperature range.
2. All voltage measurements are referenced to ground (GND). For testing, all inputs swing between 0.4V and 2.4V with a transition time of 5ns
maximum. For X1/CLK this swing is between 0.4V and 4.4V. All time measurements are referenced at input voltages of 0.8V and 2.0V and
output voltages of 0.8V and 2.0V, as appropriate.
3. Typical values are at +25°C, typical supply voltages, and typical processing parameters.
4. Test conditions for outputs: C
L
= 150pF, except interrupt outputs. Test conditions for interrupt outputs: C
L
= 50pF, R
L
= 2.7K to V
CC
.
5. All outputs are disconnected. Inputs are switching between CMOS levels of V
CC
-0.2V and V
SS
+ 0.2V.
6. T
A
> 0°C
7. T
A
< 0°C
8. See UART application note for 5µA.
AC CHARACTERISTICS
1,
2,
4
SYMBOL
PARAMETER
LIMITS
UNIT
SYMBOL
PARAMETER
Min Typ
3
Max
UNIT
Reset Timing (See Figure 3)
t
RES
RESET pulse width 200 ns
Bus Timing
5
(See Figure 4)
t
AS
A0-A3 setup time to RDN, WRN Low 10 ns
t
AH
A0-A3 hold time from RDN, WRN Low 100 ns
t
CS
CEN setup time to RDN, WRN Low 0 ns
t
CH
CEN hold time from RDN, WRN High 0 ns
t
RW
WRN, RDN pulse width 225 ns
t
DD
Data valid after RDN Low 175 ns
t
DA
RDN Low to data bus active
7
15 ns
t
DF
Data bus floating after RDN High 125 ns
t
DI
RDN High to data bus invalid
7
20 ns
t
DS
Data setup time before WRN High 100 ns
t
DH
Data hold time after WRN High 20 ns
t
RWD
High time between reads and/or writes
5,
6
200 ns

SCC2692AE1B44,557

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC UART DUAL W/FIFO 44QFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union