MAX17005/MAX17006/MAX17015
1.2MHz Low-Cost,
High-Performance Chargers
______________________________________________________________________________________ 19
Generally, a low gate charge high-side MOSFET is pre-
ferred to minimize switching losses. However, the
R
DS(ON)
required to stay within package power dissi-
pation often limits how small the MOSFET can be. The
optimum occurs when the switching losses equal the
conduction losses. High-side switching losses do not
usually become an issue until the input is greater than
approximately 15V. Calculating the power dissipation in
N1 due to switching losses is difficult since it must
allow for difficult quantifying factors that influence the
turn-on and turn-off times. These factors include the
internal gate resistance, gate charge, threshold volt-
age, source inductance, and PCB layout characteris-
tics. The following switching-loss calculation provides
only a very rough estimate and is no substitute for
breadboard evaluation, preferably including a verifica-
tion using a thermocouple mounted on N1:
where t
TRANS
is the drivers transition time and can be
calculated as follows:
I
GSRC
and I
GSNK
are the peak gate-drive source/sink
current (3Ω sourcing and 0.8Ω sinking, typically). The
MAX17005/MAX17006/MAX17015 control the switching
frequency as shown in the
Typical Operating
Characteristics
.
The following is the power dissipated due to high-side
n-channel MOSFET’s output capacitance (C
RSS
):
The following high-side MOSFET’s loss is due to the
reverse-recovery charge of the low-side MOSFET’s
body diode:
Ignore PD
QRR
(HighSide) if a Schottky diode is used
parallel to a low-side MOSFET.
The total high-side MOSFET power dissipation is:
Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum AC adapter
voltages are applied. If the high-side MOSFET chosen
for adequate R
DS(ON)
at low-battery voltages becomes
hot when biased from V
DCIN(MAX)
, consider choosing
another MOSFET with lower parasitic capacitance.
For the low-side MOSFET (N2), the worst-case power
dissipation always occurs at maximum input voltage:
The following additional loss occurs in the low-side
MOSFET due to the body diode conduction losses:
The total power low-side MOSFET dissipation is:
These calculations provide an estimate and are not a
substitute for breadboard evaluation, preferably
including a verification using a thermocouple mounted
on the MOSFET.
Inductor Selection
The selection of the inductor has multiple trade-offs
between efficiency, transient response, size, and cost.
Small inductance is cheap and small, and has a better
transient response due to higher slew rate; however, the
efficiency is lower because of higher RMS current. High
inductance results in lower ripple so that the need of the
output capacitors for output voltage ripple goes low.
The MAX17005/MAX17006/MAX17015 combine all the
inductor trade-offs in an optimum way by controlling
switching frequency. High-frequency operation permits
the use of a smaller and cheaper inductor, and conse-
quently results in smaller output ripple and better tran-
sient response.
The charge current, ripple, and operating frequency
(off-time) determine the inductor characteristics. For
optimum efficiency, choose the inductance according
to the following equation:
where k = 35ns/V.
L
kV
ILIR
IN
CHG MAX
=
×
××
2
4
PD LS PD LS PD LS
TOTAL COND BDY
() () ()≈+
PD LS I V
BDY PEAK
() . . ×005 04
PD LS
V
V
I
COND
BATT MIN
CSSP MAX
CH
()
()
()
=−
×1
GGDSON
R
2
×
()
PD HS PD HS PD HS
TOTAL COND SW
() () ()≈+
() ()++PD HS PD HS
CRSS QRR
PD HS
QV f
QRR
RR CSSP SW
()=
××
2
2
PD HS
VCf
CRSS
CSSP RSS SW
()
××
2
2
t
II
QQ
TRANS
GSRC GSNK
GD GS
=+
×+
()
11
PD HS t V I f
SW TRANS CSSP CHG SW
() × × ×
1
2
MAX17005/MAX17006/MAX17015
1.2MHz Low-Cost,
High-Performance Chargers
20 ______________________________________________________________________________________
For optimum size and inductor current ripple, choose
LIR
MAX
= 0.4, which sets the ripple current to 40% the
charge current and results in a good balance between
inductor size and efficiency. Higher inductor values
decrease the ripple current. Smaller inductor values
save cost but require higher saturation current capabili-
ties and degrade efficiency.
Inductor L1 must have a saturation current rating of at
least the maximum charge current plus 1/2 the ripple
current (ΔIL):
I
SAT
= I
CHG
+ (1/2) ΔIL
The ripple current is determined by:
Input Capacitor Selection
The input capacitor must meet the ripple current
requirement (I
RMS
) imposed by the switching currents.
Nontantalum chemistries (ceramic, aluminum, or
OS-CON) are preferred due to their resilience to power-
up and surge currents:
The input capacitors should be sized so that the tem-
perature rise due to ripple current in continuous con-
duction does not exceed approximately 10°C. The
maximum ripple current occurs at 50% duty factor or
V
DCIN
= 2 x V
BATT
, which equates to 0.5 x I
CHG
. If the
application of interest does not achieve the maximum
value, size the input capacitors according to the worst-
case conditions.
Output Capacitor Selection
The output capacitor absorbs the inductor ripple cur-
rent and must tolerate the surge current delivered from
the battery when it is initially plugged into the charger.
As such, both capacitance and ESR are important
parameters in specifying the output capacitor as a filter
and to ensure the stability of the DC-to-DC converter
(see the
Compensation
section.) Beyond the stability
requirements, it is often sufficient to make sure that the
output capacitor’s ESR is much lower than the battery’s
ESR. Either tantalum or ceramic capacitors can be
used on the output. Ceramic devices are preferable
because of their good voltage ratings and resilience to
surge currents. Choose the output capacitor based on:
Choose k
CAP-BIAS
is a derating factor of 2 for typical 25V-
rated ceramic capacitors.
For f
SW
= 800kHz, I
RIPPLE
= 1A, and to get ΔV
BATT
=
70mV, choose C
OUT
as 4.7μF.
If the internal resistance of battery is close to the ESR of
the output capacitor, the voltage ripple is shared with
the battery and is less than calculated.
Applications Information
Setting Input Current Limit
The input current limit should be set based on the cur-
rent capability of the AC adapter and the tolerance of
the input current limit. The upper limit of the input cur-
rent threshold should never exceed the adapter’s mini-
mum available output current. For example, if the
adapter’s output current rating is 5A ±10%, the input
current limit should be selected so that its upper limit is
less than 5A × 0.9 = 4.5A. Since the input current-limit
accuracy of the MAX17005/MAX17006/MAX17015 is
±3%, the typical value of the input current limit should
be set at 4.5A/1.03 4.36A. The lower limit for input
current must also be considered. For chargers at the
low end of the spec, the input current limit for this
example could be 4.36A × 0.95 or approximately 4.14A.
Layout and Bypassing
Bypass DCIN with a 0.1μF ceramic to ground (Figure 1).
N1 and N2 protect the MAX17005/MAX17006/
MAX17015 when the DC power source input is reversed.
Bypass V
AA
, CSSP, and LDO as shown in Figure 1.
Good PCB layout is required to achieve specified noise
immunity, efficiency, and stable performance. The PCB
layout designer must be given explicit instructions—
preferably, a sketch showing the placement of the
power switching components and high current routing.
Refer to the PCB layout in the MAX17005/MAX17006/
MAX17015 evaluation kit for examples. A ground plane
is essential for optimum performance. In most applica-
tions, the circuit is located on a multilayer board, and
full use of the four or more copper layers is recom-
mended. Use the top layer for high-current connec-
tions, the bottom layer for quiet connections, and the
inner layers for an uninterrupted ground plane.
Use the following step-by-step guide:
1) Place the high-power connections first, with their
grounds adjacent:
a) Minimize the current-sense resistor trace lengths,
and ensure accurate current sensing with Kelvin
connections.
b) Minimize ground trace lengths in the high-current
paths.
C
I
fV
k
OUT
RIPPLE
SW BATT
CAP BIAS
=
××
×
8 Δ
II
VVV
V
RMS CHG
BATT DCIN BATT
DCIN
=
×−
()
×
Δ=
×
IL
kV
L
IN
2
4
MAX17005/MAX17006/MAX17015
1.2MHz Low-Cost,
High-Performance Chargers
______________________________________________________________________________________ 21
c) Minimize other trace lengths in the high-current
paths.
d) Use > 5mm wide traces in the high-current
paths.
e) Connect C
IN
to high-side MOSFET (10mm max
length).
f) Minimize the LX node (MOSFETs, rectifier cath-
ode, inductor (15mm max length)). Keep LX on
one side of the PCB to reduce EMI radiation.
Ideally, surface-mount power components are flush
against one another with their ground terminals
almost touching. These high-current grounds are
then connected to each other with a wide, filled
zone of top-layer copper, so they do not go through
vias. The resulting top-layer subground plane is
connected to the normal inner-layer ground plane
at the paddle. Other high-current paths should also
be minimized, but focusing primarily on short
ground and current-sense connections eliminates
about 90% of all PCB layout problems.
2) Place the IC and signal components. Keep the
main switching node (LX node) away from sensitive
analog components (current-sense traces and V
AA
capacitor). Important: the IC must be no further than
10mm from the current-sense resistors. Quiet con-
nections to V
AA
and CC should be returned to a sep-
arate ground (GND) island. There is very little current
flowing in these traces, so the ground island need not
be very large. When placed on an inner layer, a siz-
able ground island can help simplify the layout
because the low-current connections can be made
through vias. The ground pad on the backside of the
package should also be connected to this quiet
ground island.
3) Keep the gate drive traces (DHI and DLO) as short
as possible (L < 20mm), and route them away from
the current-sense lines and V
AA
. These traces
should also be relatively wide (W > 1.25mm).
4) Place ceramic bypass capacitors close to the IC.
The bulk capacitors can be placed further away.
Place the current-sense input filter capacitors under
the part, connected directly to the GND pin.
5) Use a single-point star ground placed directly
below the part at the PGND pin. Connect the power
ground (ground plane) and the quiet ground island
at this location.

MAX17005ETP+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
IC MULTI-CHEM BATT CHRGR 20-TQFN
Lifecycle:
New from this manufacturer.
Delivery:
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