Vishay Siliconix
SiR464DP
New Product
Document Number: 68871
S-82017-Rev. A, 01-Sep-08
www.vishay.com
1
N-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free
TrenchFET
®
Power MOSFET
100 % R
g
and UIS Tested
APPLICATIONS
DC/DC Conversion
- Low-Side Switch
Notebook
Server
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a, e
Q
g
(Typ.)
30
0.0031 at V
GS
= 10 V
50
26.5 nC
0.0038 at V
GS
= 4.5 V
50
Ordering Information: SiR464DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK SO-8
Bottom View
N
-Channel MOSFET
G
D
S
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 65 °C/W.
e. Package limited.
f. See Solder Profile (
http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
g. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
50
e
A
T
C
= 70 °C
50
e
T
A
= 25 °C
29.5
b, c
T
A
= 70 °C
23.5
b, c
Pulsed Drain Current
I
DM
70
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
50
e
T
A
= 25 °C
4.7
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
40
Avalanche Energy
E
AS
80
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
69
W
T
C
= 70 °C
44.4
T
A
= 25 °C
5.2
b, c
T
A
= 70 °C
3.3
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
f, g
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
19 24
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
1.2 1.8
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 68871
S-82017-Rev. A, 01-Sep-08
Vishay Siliconix
SiR464DP
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 1 mA
30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
27
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 5.6
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.2 2.5 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 15 A
0.0026 0.0031
Ω
V
GS
= 4.5 V, I
D
= 10 A
0.0031 0.0038
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 15 A
75 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
3545
pFOutput Capacitance
C
oss
650
Reverse Transfer Capacitance
C
rss
240
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 10 A
62 95
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 10 A
26.5 40
Gate-Source Charge
Q
gs
8.5
Gate-Drain Charge
Q
gd
7.3
Gate Resistance
R
g
f = 1 MHz 0.2 1.1 2.2 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1 Ω
35 60
ns
Rise Time
t
r
16 30
Turn-Off Delay Time
t
d(off)
48 85
Fall Time
t
f
16 30
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
18 35
Rise Time
t
r
816
Turn-Off Delay Time
t
d(off)
41 70
Fall Time
t
f
918
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
50
A
Pulse Diode Forward Current
a
I
SM
70
Body Diode Voltage
V
SD
I
S
= 3 A
0.72 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
33 65 ns
Body Diode Reverse Recovery Charge
Q
rr
27 54 nC
Reverse Recovery Fall Time
t
a
17
ns
Reverse Recovery Rise Time
t
b
16
Document Number: 68871
S-82017-Rev. A, 01-Sep-08
www.vishay.com
3
Vishay Siliconix
SiR464DP
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
14
28
42
56
70
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
=10thru 4 V
V
GS
=3V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
0.0020
0.0025
0.0030
0.0035
0.0040
0.0045
01428 42 56 70
V
GS
=4.5V
V
GS
=10V
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
0
2
4
6
8
10
0 1326395265
V
DS
=20V
I
D
=10A
V
DS
=15V
V
DS
=10V
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
012345
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
V
GS
- Gate-to-Source Voltage (V )
- Drain Current (A)I
D
C
rss
0
900
1800
2700
3600
4500
0 6 12 18 24 30
C
iss
C
oss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150
V
GS
=4.5V
V
GS
=10V
I
D
=15A
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)

SIR464DP-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V 50A 69W 3.1mohm @ 10V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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