5
Regulatory Information
The HCPL-2602/2612 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Solder Reflow Thermal Profile
0
TIME (SECONDS)
TEMPERATURE (°C)
200
100
50 150100 200 250
300
0
30
SEC.
50 SEC.
30
SEC.
160°C
140°C
150°C
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
SOLDERING
TIME
200°C
PREHEATING TIME
150°C, 90 + 30 SEC.
2.5°C ± 0.5°C/SEC.
3°C + 1°C/–0.5°C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
Recommended Pb-Free IR Profile
217 °C
RAMP-DOWN
6 °C/SEC. MAX.
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
260 +0/-5 °C
t 25 °C to PEAK
60 to 150 SEC.
20-40 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
t
p
t
s
PREHEAT
60 to 180 SEC.
t
L
T
L
T
smax
T
smin
25
T
p
TIME
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Insulation and Safety Related Specifications
Parameter Symbol Value Units Conditions
Min. External Air Gap L(I01) 7.1 mm Measured from input terminals to output terminals,
(External Clearance) shortest distance through air.
Min. External Tracking L(I02) 7.4 mm Measured from input terminals to output terminals,
Path (External Creepage) shortest distance path along body.
Min. Internal Plastic 0.08 mm Through insulation distance, conductor to conductor,
Gap (Internal Clearance) usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
Tracking Resistance CTI 200 V DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking
Index)
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
