SST25WF020A
DS20005139E-page 32 2014 Microchip Technology Inc.
Microchip Technology Drawing C04-203B Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
L
(DATUM A)
e
e/2
L3
DETAIL A
L1
8-Lead Plastic Ultra Thin Small Outline No Lead Package (NP) - 2x3 mm Body [USON]
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Package Edge to Terminal Edge
Exposed Pad Width
Exposed Pad Length
Terminal Length
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E
D2
E2
L3
e
L
D
N
0.50 BSC
0.35
1.55
0.15
0.40
0.20
0.50
0.00
0.25
3.00 BSC
0.45
0.20
1.60
0.55
0.02
2.00 BSC
MILLIMETERS
MIN
NOM
8
1.65
0.25
0.50
0.30
0.60
0.05
MAX
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
0.30 0.40
Package Edge to Terminal Edge L1 — 0.10 —
