B82799C333N1

7 10/08
L
R
= 0.22 mH
L
R
= 0.47 mH
L
R
= 0.33 mH
Current derating I
op
/I
R
versus ambient temperature
IND0007-U
0
Hz
10
20
30
40
50
dB
4
10 10
5
10
6
10
7
10
8
10
9
f
α
B82799C0224N001
IND0008-3
0
Hz
10
20
30
40
50
dB
4
10 10
5
10
6
10
7
10
8
10
9
f
α
B82799C0474N001
IND0037-H
0
Hz
10
20
30
40
50
dB
4
10 10
5
10
6
10
7
10
8
10
9
f
α
B82799C0334N001
IND0001-C-E
20
0
40 60 80 100 120 160
0.2
0.4
0.6
0.8
1.0
1.2
B82799
C
A
T
op
I
I
R
R
T = 60 C
Insertion loss α (typical values at |Z| = 50 Ω, 20 °C)
asymmetrical, all branches in parallel (common mode)
symmetrical (differential mode)
B82799C0/S0Data and signal line chokes
Common-mode chokes, ring core, EIA 1812
8 10/08
Please read Cautions and warnings and
Important notes at the end of this document.
Recommended reflow soldering curve
Pb containing solder material (based on CECC 00802 edition 2)
Pb-free solder material (based on JEDEC J-STD 020C)
Time from 25 °C to T
4
: max 300 s
Maximal numbers of reflow cycles: 3
T
1
°C
T
2
°C
T
3
°C
T
4
°C
t
1
s
t
2
s
t
3
s
150 200 217 250 < 110 < 90 < 40 @ T
4
–5 °C
IND0813-D-E
0
0
50
100
150
200
250
300
Temperature
Time
50 100 150 200 250
s
2 K/s
approx. 245
10 s
10 s
Normal curve
Limit curves
˚
C
40 s
approx.
260
˚
C
C
˚
C
˚
215
180
˚
C
130 C
˚
IND0814-F
1
t
4
T
T
3
T
2
T
1
t
2
3
t
B82799C0/S0Data and signal line chokes
Common-mode chokes, ring core, EIA 1812
9 10/08
Cautions and warnings
Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
Particular attention should be paid to the derating curves given there.
The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
The following points must be observed if the components are potted in customer applications:
Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
The effect of the potting material can change the high-frequency behaviour of the components.
Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.

B82799C333N1

Mfr. #:
Manufacturer:
EPCOS / TDK
Description:
CMC 33UH 200MA 2LN SMD AEC-Q200
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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