SI3424CDV-T1-GE3

Vishay Siliconix
Si3424CDV
Document Number: 67443
S11-0863-Rev. A, 02-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 30 V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
•TrenchFET
®
Power MOSFET
100 % R
g
Test e d
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Load Switch for Portable Devices
DC/DC Converters
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(A)
a, b
Q
g
(Typ.)
30
0.026 at V
GS
= 10 V
8
4.2
0.032 at V
GS
= 4.5 V
8
Notes:
a. Package limited.
b. Based on T
C
= 25 °C.
c. Surface mounted on 1" x 1" FR4 board.
d. t = 5 s.
e. Maximum under steady state conditions is 110 °C/W.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
8
a
A
T
C
= 70 °C
7.7
T
A
= 25 °C
7.2
c, d
T
A
= 70 °C
5.7
c, d
Pulsed Drain Current (t = 300 µs)
I
DM
20
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
3
A
T
A
= 25 °C
1.7
c, d
Maximum Power Dissipation
T
C
= 25 °C
P
D
3.6
W
T
C
= 70 °C
2.3
T
A
= 25 °C
2.0
c, d
T
A
= 70 °C
1.3
c, d
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
e
t 5 s
R
thJA
50 62.5 °C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
28 35
Marking Code
BC XX
Lot Tracea b ility
and Date Code
Part # Code
Y
Y
TSOP-6
Top View
6
4
1
2
3
5
3 mm
2.85 mm
D
D
D
D
S
G
N-Channel MOSFET
G
D
S
(1, 2, 5, 6)
(3)
(4)
Ordering Information: Si3424CDV-T1-GE3 (Lead (Pb)-free and Halogen-free)
www.vishay.com
2
Document Number: 67443
S11-0863-Rev. A, 02-May-11
Vishay Siliconix
Si3424CDV
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
28
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
- 3.7
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
12.5V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 85 °C
10
On-State Drain Current
a
I
D(on)
V
DS
= 5 V, V
GS
= 10 V 20 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 7.2 A
0.021 0.026
V
GS
= 4.5 V, I
D
= 6.5 A
0.026 0.032
Forward Transconductance
g
fs
V
DS
= 15 V, I
D
= 7.2 A
17 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
405
pFOutput Capacitance
C
oss
92
Reverse Transfer Capacitance
C
rss
42
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 7.2 A
8.3 12.5
nC
V
DS
= 24 V, V
GS
= 4.5 V, I
D
= 7.2 A
4.2 6.3
Gate-Source Charge
Q
gs
1.2
Gate-Drain Charge
Q
gd
1.6
Gate Resistance
R
g
f = 1 MHz 0.6 3 6
Tur n-On D e l ay T i m e
t
d(on)
V
DD
= 15 V, R
L
= 2.6
I
D
5.7 A, V
GEN
= 10 V, R
g
= 1
36
ns
Rise Time
t
r
12 20
Turn-Off DelayTime
t
d(off)
16 24
Fall Time
t
f
816
Tur n - On D e l ay T i m e
t
d(on)
V
DD
= 15 V, R
L
= 2.6
I
D
5.7 A, V
GEN
= 4.5 V, R
g
= 1
10 20
Rise Time
t
r
22 33
Turn-Off DelayTime
t
d(off)
15 23
Fall Time
t
f
918
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
I
S
T
C
= 25 °C
3
A
Pulse Diode Forward Current
a
I
SM
20
Body Diode Voltage
V
SD
I
S
= 5.7 A
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 5.7 A, dI/dt = 100 A/µs
13 20 nC
Body Diode Reverse Recovery Charge
Q
rr
510
nsReverse Recovery Fall Time
t
a
8
Reverse Recovery Rise Time
t
b
5
Document Number: 67443
S11-0863-Rev. A, 02-May-11
www.vishay.com
3
Vishay Siliconix
Si3424CDV
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
5
10
15
20
0 0.2 0.4 0.6 0.8 1
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
V
GS
= 10 V thru 4 V
V
GS
= 3 V
0.010
0.016
0.022
0.028
0.034
0 5 10 15 20
R
DS(on)
- On-Resistance (Ω)
I
D
-Drain Current (A)
V
GS
= 4.5 V
V
GS
= 10 V
0
2
4
6
8
10
0246810
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
I
D
= 7.2 A
V
DS
= 15 V
V
DS
= 8 V
V
DS
= 24 V
Transfer Characteristics Curves vs. Temp.
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
00.511.522.5
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
T
C
= 125 °C
T
C
= 25 °C
T
C
= - 55 °C
0
150
300
450
600
0 6 12 18 24 30
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
C
iss
C
oss
C
rss
0.6
0.8
1.0
1.2
1.4
1.6
-50-250 255075100125150
R
DS(on)
-On-Resistance
(Normalized)
T
J
- Junction Temperature (°C)
V
GS
= 10 V, I
D
= 7.2 A
V
GS
= 4.5 V, I
D
= 6.5 A

SI3424CDV-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 30V Vds 20V Vgs TSOP-6
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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