FDS6162N3 Rev B2 (W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown
Voltage
V
GS
= 0 V, I
D
= 250 µA
20
V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250 µA, Referenced to 25°C
13
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= 16 V, V
GS
= 0 V 1
µA
I
GSSF
Gate–Body Leakage, Forward V
GS
= 12 V, V
DS
= 0 V 100 nA
I
GSSR
Gate–Body Leakage, Reverse V
GS
= –12 V , V
DS
= 0 V –100 nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250 µA
0.6 0.9 1.5 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250 µA, Referenced to 25°C
–4
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= 4.5 V, I
D
= 21 A
V
GS
= 2.5 V, I
D
= 18 A
V
GS
= 4.5 V, I
D
= 21 A, T
J
= 125°C
3.3
4.3
4.8
4.5
6.0
7.2
mΩ
g
FS
Forward Transconductance V
DS
= 5 V, I
D
= 21 A 119 S
Dynamic Characteristics
C
iss
Input Capacitance 5521 pF
C
oss
Output Capacitance 1473 pF
C
rss
Reverse Transfer Capacitance
V
DS
= 10 V, V
GS
= 0 V,
f = 1.0 MHz
706 pF
R
G
Gate Resistance V
GS
= 15 mV, f = 1.0 MHz 1.3
Ω
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 20 32 ns
t
r
Turn–On Rise Time 25 40 ns
t
d(off)
Turn–Off Delay Time 85 136 ns
t
f
Turn–Off Fall Time
V
DD
= 10 V, I
D
= 1 A,
V
GS
= 4.5 V, R
GEN
= 6 Ω
55 88 ns
Q
g
Total Gate Charge 52 73 nC
Q
gs
Gate–Source Charge 9 nC
Q
gd
Gate–Drain Charge
V
DS
= 10 V, I
D
= 21 A,
V
GS
= 4.5 V
14.5 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current 2.5 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= 2.5 A (Note 2)
0.6
1.2
V
t
rr
Diode Reverse Recovery Time 42 nS
Q
rr
Diode Reverse Recovery Charge
I
F
= 21 A,
d
iF
/d
t
= 100 A/µs
52 nC
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 40°C/W when
mounted on a 1in
2
pad
of 2 oz copper
b) 85°C/W when mounted on
a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS6162N3
