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MC74LVX4066M

P1-P3P4-P6P7-P9P10-P12P13-P13
MC74LVX4066
http://onsemi.com
10
+5 V
14
LVX4066
CONTROL
INPUTS
7
5
6
14
15
LSTTL/
NMOS
ANALOG
SIGNALS
R* R* R* R*
ANALOG
SIGNALS
R* = 2 TO 10 kW
V
DD
= 5 V V
CC
= 2.0 TO 7.0 V
ANALOG
SIGNALS
ANALOG
SIGNALS
116 14
CONTROL
INPUTS
78
MC14504
13
3
5
7
9
11
14
2
4
6
10
5
6
14
15
CHANNEL 4
CHANNEL 3
CHANNEL 2
CHANNEL 1
1 OF 4
SWITCHES
COMMON I/O
1234
CONTROL INPUTS
INPUT
OUTPUT
0.01 mF
LF356 OR
EQUIVALENT
a. Using Pull-Up Resistors b. Using LVXT4066
Figure 18. LSTTL/NMOS to CMOS Interface
Figure 19. TTL/NMOS−to−CMOS Level Converter
Analog Signal Peak−to−Peak Greater than 5 V
Figure 20. 4−Input Multiplexer Figure 21. Sample/Hold Amplifier
+
-
1 OF 4
SWITCHES
+5 V
14
CONTROL
INPUTS
7
5
6
14
15
LSTTL/
NMOS/
ABT/
ALS
ANALOG
SIGNALS
ANALOG
SIGNALS
1 OF 4
SWITCHES
1 OF 4
SWITCHES
1 OF 4
SWITCHES
LVXT4066
LVX4066
MC74LVX4066
http://onsemi.com
11
PACKAGE DIMENSIONS
SOIC−14
D SUFFIX
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
−B−
G
P
7 PL
14
8
7
1
M
0.25 (0.010) B
M
S
B
M
0.25 (0.010) A
S
T
−T−
F
R
X 45
SEATING
PLANE
D 14 PL
K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
__ __
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
7X
MC74LVX4066
http://onsemi.com
12
PACKAGE DIMENSIONS
TSSOP−14
DT SUFFIX
CASE 948G−01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
−U−
SEATING
PLANE
0.10 (0.004)
−T−
SECTION N−N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
P1-P3P4-P6P7-P9P10-P12P13-P13

MC74LVX4066M

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Buy MC74LVX4066M
Manufacturer:
ON Semiconductor
Description:
IC MUX/DEMUX QUAD 1X1 14SOEIAJ
Lifecycle:
New from this manufacturer.
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