Data Sheet ADRF5021
Rev. A | Page 9 of 12
THEORY OF OPERATION
The ADRF5021 requires a positive supply voltage applied to the
VDD pin and a negative supply voltage applied to the VSS pin.
Bypassing capacitors are recommended on the supply lines to
minimize RF coupling.
The ADRF5021 is internally matched to 50 Ω at the RF common
port (RFC) and the RF throw ports (RF1 and RF2); therefore,
no external matching components are required. All of the RF
ports are dc-coupled to 0 V, and no dc blocking is required at the
RF ports when the RF line potential is equal to 0 V. The design
is bidirectional; the RF input signal can be applied to the RFC
port while the RF throw port (RF1 or RF2) is output or vice versa.
The ADRF5021 incorporates a driver to perform logic functions
internally and to provide the user with the advantage of a simplified
control interface. The driver features two digital control input
pins, CTRL and EN.
When the EN pin is logic low, the RF1 to RFC path is in an
insertion loss state, and the RF2 to RFC path is in an isolation
state, or vice versa, depending on the logic level applied to the
CTRL pin. The insertion loss path (for example, RF1 to RFC)
conducts the RF signal equally well in both directions between
its throw port (for example, RF1) and common port (RFC). The
isolation path (for example, RF2 to RFC) provides high loss
between the insertion loss path and its throw port (for example,
RF2) terminated to an internal 50 Ω resistor.
When the EN pin is logic high, both the RF1 to RFC path and
the RF2 to RFC path are in an isolation state regardless of the
logic state of CTRL. RF1 and RF2 ports are terminated to
internal 50 resistors, and RFC becomes open reflective.
The ideal power-up sequence is as follows:
1. Power up GND.
2. Power up VDD and VSS. The relative order is not
important.
3. Power up the digital control inputs. The relative order of
the logic control inputs is not important. However,
powering the digital control inputs before the VDD supply
can inadvertently forward bias and damage the internal
ESD protection structures.
4. Apply an RF input signal.
Table 4. Control Voltage Truth Table
Digital Control Input RF Paths
EN CTRL RF1 to RFC RF2 to RFC
Low Low Isolation (off) Insertion loss (on)
Low High Insertion loss (on) Isolation (off)
High Low Isolation (off) Isolation (off )
High High Isolation (off ) Isolation (off )
ADRF5021 Data Sheet
Rev. A | Page 10 of 12
APPLICATIONS INFORMATION
EVALUATION BOARD
Figure 18 and Figure 19 show the top and cross sectional views
of the evaluation board, which uses 4-layer construction with a
copper thickness of 0.5 oz (0.7 mil) and dielectric materials
between each copper layer.
1500mil
940mil
828mil
40mil
40mil
EDGE PLATING 5 × 520mil
570mil
R 32mil
14580-018
Figure 18. Evaluation Board Layout (Top View)
0.5oz Cu (0.7mil) 0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
0.5oz Cu (0.7mil)
RO4003
FR4
FR4
0.5oz Cu (0.7mil)
TOTAL THICKNESS
~62mil
W = 14mil
G = 5mil
T = 0.7mil
H = 8mil
14580-019
Figure 19. Evaluation Board (Cross Sectional View)
All RF and dc traces are routed on the top copper layer whereas
the inner and bottom layers are grounded planes that provide
a solid ground for the RF transmission lines. Top dielectric
material is 8 mil Rogers RO4003, offering good high frequency
performance. The middle and bottom dielectric materials are
FR-4 type materials to achieve an overall board thickness of
62 mil.
The RF transmission lines were designed using a coplanar
waveguide (CPWG) model with a width of 14 mil and ground
spacing of 5 mil to have a characteristic impedance of 50 Ω. For
good RF and thermal grounding, as many plated through vias
as possible are arranged around transmission lines and under
the exposed pad of the package.
Figure 20 shows the actual ADRF5021 evaluation board with
component placement. Two power supply ports are connected
to the VDD and VSS test points, TP5 and TP2, and the ground
reference is connected to the GND test point, TP1. On each
supply trace, a 100 pF bypass capacitor is used, and unpopulated
components positions are available for applying extra bypass
capacitors.
14580-020
Figure 20. Populated Evaluation Board
Two control ports are connected to the EN and CTRL test
points, TP3 and TP4. On each control trace, a resistor position
is available to improve the isolation between the RF and control
signals. The RF ports are connected to the RFC, RF1, and RF2
connectors (J1, J2, and J3) that are end launch 2.4 mm RF
connectors. A through transmission line that connects
unpopulated RF connectors (J7 and J8) is also available to
measure the loss of the PCB. Figure 21 and Table 5 are the
evaluation board schematic and bill of materials, respectively.
The evaluation board shown in Figure 20 is available from
Analog Devices, Inc., upon request.
Data Sheet ADRF5021
Rev. A | Page 11 of 12
GND
RF2
GND
GND
GND
GND
GND
RF1
GND
GND
GND
GND
RFC
GND
GND
GND
EN
VSS
VSS
CTRL
VDD
EN
CTRL
VDD
1
2
3
4
5
6 7 8 9 10
11
12
13
14
15
1617181920
U1
J1
J3
J2
J7
DEPOP
J8
DEPOP
THR_CAL
RF2
RFC
RF1
R2
0Ω
R1
0Ω
TP5
TP4
TP3
TP2
TP1
C5
100pF
C2
100pF
DEPOP
C1
10µF
DEPOP
C4
100pF
C3
100nF
DEPOP
C6
10µF
DEPOP
14580-021
Figure 21. Evaluation Board Schematic
Table 5. Bill of Materials, Evaluation Board Components
Component Description
J1, J2, J3 End launch connectors, 2.4 mm
J7, J8 Unpopulated end launch connectors, 2.4 mm
TP1 to TP5 Through hole mount test points
C4, C5 100 pF capacitors, 0402 package
C2, C3 Unpopulated capacitors, 0402 package
C1, C6 Unpopulated capacitors, 0603 package
R1, R2 0 Ω resistors, 0402 package
U1 ADRF5021 SPDT switch
PCB 600-01583-00-1 evaluation PCB
PROBE MATRIX BOARD
Figure 22 and Figure 23 show the top and cross sectional views
of the probe matrix board that measures the s-parameters of the
ADRF5021 at close proximity to RF pins using the GSG probes.
The actual board duplicates the same layout in matrix form to
assemble multiple devices and uses RF traces for through,
reflect, and line (TRL) calibration.
220mil
340mil
14580-022
Figure 22. Probe Board Layout (Top View)
0.5oz Cu 0.5oz Cu
0.5oz Cu
RO4003
0.5oz Cu
W = 14mil
G = 5mil
T = 0.7mil
H = 8mil
14580-023
Figure 23. Probe Matrix Board (Cross Sectional View)

ADRF5021BCCZN

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Switch ICs High isolation SPDT, 30GHz, low cut-off
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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