4
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specied for individual equipment
standards. For creepage, the shortest distance path along
Regulatory Information
The HCPL-0738 has been
approved by the following
organizations:
UL
Recognized under UL 1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(Option 060 only)
the surface of a printed circuit board between the solder
llets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board
to achieve desired creepage and clearances. Creepage
and clearance distances will also change depending on
factors such as pollution degree and insulation level.
Insulation and Safety Related Specications (approval pending)
Parameter Symbol Value Units Conditions
Minimum External Air Gap L(I01) 4.9 mm Measured from input terminals to output terminals,
(Clearance) shortest distance through air.
Minimum External Tracking L(I02) 4.8 mm Measured from input terminals to output terminals,
(Creepage) shortest distance path along body.
Minimum Internal Plastic Gap 0.08 mm Insulation thickness between emitter and detector; also
(Internal Clearance) known as distance through insulation.
Tracking Resistance CTI ≥ 175 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative Tracking Index)
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Units
Storage Temperature T
S
–55 125 ˚C
Ambient Operating Temperature T
A
–40 100 ˚C
Supply Voltage V
DD
0 6.0 Volts
Output Voltage V
O
–0.5 V
DD
+ 0.5 Volts
Average Forward Input Current I
F
— 20 mA
Average Output Current I
O
— 2 mA
Lead Solder Temperature 260˚C for 10 seconds, 1.6 mm below seating plane
Solder Reow Temperature Prole See Solder Reow Thermal Prole section
Recommended Operating Conditions
Parameter Symbol Minimum Maximum Units
Ambient Operating Temperature T
A
–40 100 ˚C
Supply Voltages V
DD
4.5 5.5 V
Input Current (ON) I
F
10 16 mA