BENEFITS
• Scalability: Tsi576 footprint compatibility
allows system scaling depending on systems
cost and performance requirements
•
Performance: Improved system and distributed
processing performance
•
Cost; Designed for more cost-sensitive applications
•
Power: Lowest power product in Tsi57x portfolio
Specifications
• Technology: 0.13um
• Voltage: 1.2V and 3.3V
• Low power consumption
• Package: 399 ball, 21mm x 21mm,
1mm ball pitch HSBGA
•
Rated for commercial and industrial temperatures
• Pin compatible with the Tsi576
Target Markets
• Wireless Infrastructure
– WiMax
– 3G LTE
– eWCDMA
– Node B, Radio Network Controller,
Media Gateway
• Communications Wireline Infrastructure
– Multiservice WAN Switches, 1 to 10 Gbit
Ethernet Switches, 1 to >10Gbit Routers, DSLAMs
• Video Infrastructure
– Broadcast, imaging, and encoding
– Video conference systems
– Video head-end infrastructure
– Video telepresence
• Architecture Standards
– ATCA, MicroTCA, VXS, VPX
IDT
|
THE ANALOG
+
DIGITAL COMPANY TSI572
SERIAL RAPIDIO SWITCH PRODUCT BRIEF
Integrated DeviceTechnology
2
Tsi572
™
Serial RapidIO Switch
POWER MANAGEMENT
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ANALOG & RF
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INTERFACE & CONNECTIVITY
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CLOCKS & TIMING
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MEMORY & LOGIC
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TOUCH & USER INTERFACE
|
VIDEO & DISPLAY
|
AUDIO
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters
of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied
warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. © Copyright 2011. All rights reserved.
PB TSI572 SRIO SWCH PB REV50311
Discover what IDT know-how
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®
Tsi572
DSPDSP
DSP
DSPDSP
DSP
4x mode
Backplane
®
Tsi572
DSP
DSP
FPGA
DSP
Micro
Processor
4x mode
Backplane
4x mode
Video Card DSP Application
Wireless Baseband Processor Application
Typical Applications
The Tsi572 is ideal for many embedded applications because it provides chip-to-chip interconnect
between I/O devices and 4x links to backplanes. The Tsi572 supports multiple backplanes, inlcuding
those compliant with PICMG AMC 4, which has a data rate of up to 10 Gbps.
The Tsi572 enables high performance peer-to-peer communication through its non-blocking switch
fabric for systems with multiple RapidIO-enabled processors. With the Tsi572, system OEMs can design
multiple software applications on the same base hardware by leveraging the RapidIO-enabled
architecture. For video applications, which have critical high frame size and rate performance
requirements, the Tsi572 offers DSP aggregation with low latency.
The Tsi572 brings many advantages to wireless applications. It provides a unified platform for WiMAX,
eWCDMA, or 3G LTE, and aggregates the key hardware components with three layer hardware
termination. It also frees the FPGA, ASIC, DSP and microprocessor resources for application tasks
such as OFDMA PHY processing, MAC layer processing, symbol and chip rate processing tasks.
