8
Intensity Bin Limits (mcd)
Green
IV Bin Category Min. Max.
M 5.401 8.6
N 8.601 13.7
P 13.701 21.8
Tolerance: ±15%
Yellow
IV Bin Category Min. Max.
N 8.601 13.7
P 13.701 21.80
Q 21.801 34.7
Tolerance: ±15%
SMT Soldering Prole
Pb free reow soldering Prole
Red
IV Bin Category Min. Max.
N 8.601 13.7
P 13.701 21.80
Q 21.801 34.7
Tolerance: ±15%
Orange
IV Bin Category Min. Max.
N 8.601 13.7
P 13.701 21.80
Q 21.801 34.7
R 34.701 55.2
Tolerance: ±15%
Note:
1. Bin categories are established for classication of products. Products
may not be available in all categories. Please contact your Avago
representative for information on currently available bins.
Recommended soldering pattern (unit: mm)
2.6
1.9 x 4 = 7.6
12.8
1.4
Recommended stencil window opening is 80%
245°C
TIME
TEMPERATURE
6°C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
3°C/SEC. MAX.
3°C/SEC. MAX.
10 - 30 SEC.
150°C
200°C
217°C
(Acc. to J-STD-020C)
Notes:
1. The peak temperature refers to the peak package body
temperature.
2. Number of reow process shall be limited to maximum 2 times only.
Cooling process to normal temperature is required between rst
and second soldering process.
